| Literature DB >> 26984768 |
Efrén Navarro-Moratalla1, Joshua O Island2, Samuel Mañas-Valero1, Elena Pinilla-Cienfuegos1, Andres Castellanos-Gomez2, Jorge Quereda3, Gabino Rubio-Bollinger3,4, Luca Chirolli5, Jose Angel Silva-Guillén5, Nicolás Agraït3,4,5, Gary A Steele2, Francisco Guinea5, Herre S J van der Zant2, Eugenio Coronado1.
Abstract
The ability to exfoliate layered materials down to the single layer limit has presented the opportunity to understand how a gradual reduction in dimensionality affects the properties of bulk materials. Here we use this top-down approach to address the problem of superconductivity in the two-dimensional limit. The transport properties of electronic devices based on 2H tantalum disulfide flakes of different thicknesses are presented. We observe that superconductivity persists down to the thinnest layer investigated (3.5 nm), and interestingly, we find a pronounced enhancement in the critical temperature from 0.5 to 2.2 K as the layers are thinned down. In addition, we propose a tight-binding model, which allows us to attribute this phenomenon to an enhancement of the effective electron-phonon coupling constant. This work provides evidence that reducing the dimensionality can strengthen superconductivity as opposed to the weakening effect that has been reported in other 2D materials so far.Entities:
Year: 2016 PMID: 26984768 PMCID: PMC5512558 DOI: 10.1038/ncomms11043
Source DB: PubMed Journal: Nat Commun ISSN: 2041-1723 Impact factor: 14.919
Figure 1Atomically thin TaS2 devices.
(a) Ball and stick model of the crystal structure of the 2H polytype of TaS2. The dashed prism encloses the content of a single unit cell and the metal coordination geometry is highlighted by the red polyhedron. (b) Atomic force microscopy image of two devices fabricated on a 3.5-nm 2H-TaS2 flake. The scale bar is 4 μm in length. The full colour scale of the topograph corresponds to a height of 100 nm. (c) Line profile of the flake taken at the location of the white dotted line in b.
Figure 2Superconductivity in atomically thin crystals.
Temperature dependence of three selected devices spanning the range of thicknesses studied. (a) Current–voltage (I–V) characteristics as a function of temperature for a bulk-like 14.9 nm device. (b) Resistance (zero bias numerical derivative) versus temperature for the 14.9 nm device. (c) I–V characteristics as a function of temperature for a 5.8-nm device. (d) Resistance versus temperature for the 5.8-nm device. (e) I–V characteristics as a function of temperature for a 4.2-nm device. (f) Resistance versus temperature for the 4.2-nm device.
Figure 3Enhanced critical magnetic field in thin flakes.
Perpendicular external magnetic field dependence at 30 mK for three selected devices spanning the range of thicknesses studied. (a) Resistance (zero bias numerical derivative) versus applied field for a bulk-like, 14.9 nm device. (b) Zero bias resistance versus applied field for the 14.9-nm device. (c) Resistance (zero bias numerical derivative) versus applied field for the 5.8-nm device. (d) Zero bias resistance versus applied field for the 5.8-nm device. (e) Resistance versus applied field for the 4.2-nm device. (f) Zero bias resistance versus applied field for the 4.2-nm device.
Figure 42D superconductivity and enhanced Tc in atomically thin TaS2.
(a) Variation of Tc as a function of the thickness of the TaS2 flakes. Devices exhibiting a non-zero residual resistance below Tc are plotted in red. The error bars are given by the temperatures at 10 and 90% of the normal state resistance. The solid black line marks the bulk Tc of 600 mK. The black dotted line is an exponential trend line, fit to the data starting at the bulk limit. (b) Variation of Bc2 as a function of flake thickness. The red circles mark the same devices in a having residual resistance. The black solid line indicates the bulk limit upper critical field of 110 mT. The grey solid line plots the GL coherence lengths, calculated from the y axis Bc2 values, and marks the edge of the 2D limit.