Literature DB >> 26903237

Beam damage by the induced electric field in transmission electron microscopy.

Nan Jiang1.   

Abstract

Electric fields can be induced by electron irradiation of insulating thin film materials. In this work, the electric fields under a broad beam illumination in transmission electron microscopy (TEM) are analyzed for insulating samples. Some damage phenomena observed can be interpreted by the mechanism of damage by the induced electric field (DIEF). For broad-beam illumination in an ultra-thin specimen, the electric field near the center of the illumination may not be strong, but at the periphery of the illumination the electric field can be significant. Therefore, damage may be easily observed in these regions rather than at the center of the illumination. For a beam which is broad compared to the specimen thickness, e.g. 100∼1000nm, a strong electric field pointing inward into the specimen near the surface region may result in cation diffusion into the specimen and/or anion diffusion out to the surface region. Meanwhile, a strong electric field perpendicular to the beam direction near the edge of the illumination may attract anions into the illuminated region, but eject cations to the periphery. For a wedge-shaped specimen, the electric field points inward into thicker region, driving cations toward the thicker region, while attracting anions to the edge region. On the sharp edge, a strong electric field pointing outward may be responsible for the edge-smoothing effect observed in insulating materials.
Copyright © 2016 Elsevier Ltd. All rights reserved.

Keywords:  Beam damage; DIEF; Electric field; TEM

Year:  2016        PMID: 26903237     DOI: 10.1016/j.micron.2016.02.007

Source DB:  PubMed          Journal:  Micron        ISSN: 0968-4328            Impact factor:   2.251


  1 in total

1.  Direct observation of oxygen-vacancy formation and structural changes in Bi2WO6 nanoflakes induced by electron irradiation.

Authors:  Hong-Long Shi; Bin Zou; Zi-An Li; Min-Ting Luo; Wen-Zhong Wang
Journal:  Beilstein J Nanotechnol       Date:  2019-07-18       Impact factor: 3.649

  1 in total

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