Literature DB >> 26836692

Aspect ratio engineering of microlens arrays in thin-film flip-chip light-emitting diodes.

Peifen Zhu, Chee-Keong Tan, Wei Sun, Nelson Tansu.   

Abstract

Light extraction efficiency of thin-film flip-chip InGaN-based light-emitting diodes (LEDs) with a TiO2 microlens arrays was calculated by employing the finite-difference time-domain method. The microlens arrays, formed by embedding hexagonal close-packed TiO2 sphere arrays in a polystyrene (PS) layer, were placed on top of the InGaN LED to serve as an intermediate medium for light extraction. By tuning the thickness of the PS layer, in-coupling and out-coupling efficiencies were optimized to achieve maximum light extraction efficiency. A thicker PS layer resulted in higher in-coupling efficiency, while a thinner PS layer led to higher out-coupling efficiency. Thus, the maximum light extraction efficiency becomes a trade-off between in-coupling and out-coupling efficiency. In addition, the cavity formed by the PS layer also affects light extraction from the LED. Our study reveals that a maximum light extraction efficiency of 86% was achievable by tuning PS thickness to 75 nm with maximized in-coupling and out-coupling efficiency accompanied by the optimized resonant cavity condition.

Entities:  

Year:  2015        PMID: 26836692     DOI: 10.1364/AO.54.010299

Source DB:  PubMed          Journal:  Appl Opt        ISSN: 1559-128X            Impact factor:   1.980


  3 in total

1.  Color Shift Failure Prediction for Phosphor-Converted White LEDs by Modeling Features of Spectral Power Distribution with a Nonlinear Filter Approach.

Authors:  Jiajie Fan; Moumouni Guero Mohamed; Cheng Qian; Xuejun Fan; Guoqi Zhang; Michael Pecht
Journal:  Materials (Basel)       Date:  2017-07-18       Impact factor: 3.623

2.  Light extraction efficiency enhancement of flip-chip blue light-emitting diodes by anodic aluminum oxide.

Authors:  Yi-Ru Huang; Yao-Ching Chiu; Kuan-Chieh Huang; Shao-Ying Ting; Po-Jui Chiang; Chih-Ming Lai; Chun-Ping Jen; Snow H Tseng; Hsiang-Chen Wang
Journal:  Beilstein J Nanotechnol       Date:  2018-05-30       Impact factor: 3.649

Review 3.  Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review.

Authors:  Zheng Gong
Journal:  Nanomaterials (Basel)       Date:  2021-03-25       Impact factor: 5.076

  3 in total

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