Literature DB >> 26830466

One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices.

Su Ding1,2, Jinting Jiu2, Yue Gao2, Yanhong Tian1, Teppei Araki2, Tohru Sugahara2, Shijo Nagao2, Masaya Nogi2, Hirotaka Koga2, Katsuaki Suganuma2, Hiroshi Uchida3.   

Abstract

Copper nanowire (CuNW) conductors have been considered to have a promising perspective in the area of stretchable electronics due to the low price and high conductivity. However, the fabrication of CuNW conductors suffers from harsh conditions, such as high temperature, reducing atmosphere, and time-consuming transfer step. Here, a simple and rapid one-step photonic sintering technique was developed to fabricate stretchable CuNW conductors on polyurethane (PU) at room temperature in air environment. It was observed that CuNWs were instantaneously deoxidized, welded and simultaneously embedded into the soft surface of PU through the one-step photonic sintering technique, after which highly conductive network and strong adhesion between CuNWs and PU substrates were achieved. The CuNW/PU conductor with sheet resistance of 22.1 Ohm/sq and transmittance of 78% was achieved by the one-step photonic sintering technique within only 20 μs in air. Besides, the CuNW/PU conductor could remain a low sheet resistance even after 1000 cycles of stretching/releasing under 10% strain. Two flexible electronic devices, wearable sensor and glove-shaped heater, were fabricated using the stretchable CuNW/PU conductor, demonstrating that our CuNW/PU conductor could be integrated into various wearable electronic devices for applications in food, clothes, and medical supplies fields.

Entities:  

Keywords:  copper nanowires; one-step; photonic sintering; stretchable conductor; wearable device

Mesh:

Substances:

Year:  2016        PMID: 26830466     DOI: 10.1021/acsami.5b10802

Source DB:  PubMed          Journal:  ACS Appl Mater Interfaces        ISSN: 1944-8244            Impact factor:   9.229


  7 in total

1.  Fabricating functional circuits on 3D freeform surfaces via intense pulsed light-induced zinc mass transfer.

Authors:  Ning Yi; Yuyan Gao; Antonino Lo Verso; Jia Zhu; Daniel Erdely; Cuili Xue; Robert Lavelle; Huanyu Cheng
Journal:  Mater Today (Kidlington)       Date:  2021-08-05       Impact factor: 31.041

2.  Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper Electronics.

Authors:  Lixin Mo; Zhenxin Guo; Zhenguo Wang; Li Yang; Yi Fang; Zhiqing Xin; Xiu Li; Yinjie Chen; Meijuan Cao; Qingqing Zhang; Luhai Li
Journal:  Nanoscale Res Lett       Date:  2019-06-06       Impact factor: 4.703

3.  Highly Stretchable, Self-Healable Elastomers from Hydrogen-Bonded Interpolymer Complex (HIPC) and Their Use as Sensitive, Stable Electric Skin.

Authors:  Wan-Chen Liu; Chih-Hsiang Chung; Jin-Long Hong
Journal:  ACS Omega       Date:  2018-09-18

4.  One-step photonic curing of screen-printed conductive Ni flake electrodes for use in flexible electronics.

Authors:  Bilge Nazli Altay; Vikram S Turkani; Alexandra Pekarovicova; Paul D Fleming; Massood Z Atashbar; Martin Bolduc; Sylvain G Cloutier
Journal:  Sci Rep       Date:  2021-02-09       Impact factor: 4.379

5.  High-performance silver nanowires transparent conductive electrodes fabricated using manufacturing-ready high-speed photonic sinterization solutions.

Authors:  Luis Felipe Gerlein; Jaime Alberto Benavides-Guerrero; Sylvain G Cloutier
Journal:  Sci Rep       Date:  2021-12-17       Impact factor: 4.379

Review 6.  Recent progress of solution-processed Cu nanowires transparent electrodes and their applications.

Authors:  Su Ding; Yanhong Tian
Journal:  RSC Adv       Date:  2019-08-28       Impact factor: 4.036

Review 7.  Blood Pressure Sensors: Materials, Fabrication Methods, Performance Evaluations and Future Perspectives.

Authors:  Ahmed Al-Qatatsheh; Yosry Morsi; Ali Zavabeti; Ali Zolfagharian; Nisa Salim; Abbas Z Kouzani; Bobak Mosadegh; Saleh Gharaie
Journal:  Sensors (Basel)       Date:  2020-08-11       Impact factor: 3.576

  7 in total

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