Three-dimensional superhydrophobic copper 7,7,8,8-tetracyanoquinodimethane biointerfaces with the capability of high adhesion of osteoblasts.

A three-dimensional superhydrophobic copper 7,7,8,8-tetracyanoquinodimethane (CuTCNQ) nanowire array with the capability of high adhesion of osteoblasts was demonstrated. The CuTCNQ nanowire array was constructed by using a combined vapor deposition technique. The superhydrophobic nanowire array exhibited very high adhesion of osteoblasts, indicating that the CuTCNQ nanowire array was a good biointerface.