Literature DB >> 26367981

Low-loss compact multilayer silicon nitride platform for 3D photonic integrated circuits.

Kuanping Shang, Shibnath Pathak, Binbin Guan, Guangyao Liu, S J B Yoo.   

Abstract

We design, fabricate, and demonstrate a silicon nitride (Si(3)N(4)) multilayer platform optimized for low-loss and compact multilayer photonic integrated circuits. The designed platform, with 200 nm thick waveguide core and 700 nm interlayer gap, is compatible for active thermal tuning and applicable to realizing compact photonic devices such as arrayed waveguide gratings (AWGs). We achieve ultra-low loss vertical couplers with 0.01 dB coupling loss, multilayer crossing loss of 0.167 dB at 90° crossing angle, 50 μm bending radius, 100 × 2 μm(2) footprint, lateral misalignment tolerance up to 400 nm, and less than -52 dB interlayer crosstalk at 1550 nm wavelength. Based on the designed platform, we demonstrate a 27 × 32 × 2 multilayer star coupler.

Entities:  

Year:  2015        PMID: 26367981     DOI: 10.1364/OE.23.021334

Source DB:  PubMed          Journal:  Opt Express        ISSN: 1094-4087            Impact factor:   3.894


  3 in total

1.  Polymer/glass hybrid DC-MZI thermal optical switch for 3D-integrated chips.

Authors:  Yue Cao; Yun-Ji Yi; Bai-Zhu Lin; Yue Sun; Xin-Chi Che; Jie Zheng; Fei Wang; Da-Ming Zhang
Journal:  RSC Adv       Date:  2019-04-05       Impact factor: 4.036

2.  Silicon Nitride Photonic Integration Platforms for Visible, Near-Infrared and Mid-Infrared Applications.

Authors:  Pascual Muñoz; Gloria Micó; Luis A Bru; Daniel Pastor; Daniel Pérez; José David Doménech; Juan Fernández; Rocío Baños; Bernardo Gargallo; Rubén Alemany; Ana M Sánchez; Josep M Cirera; Roser Mas; Carlos Domínguez
Journal:  Sensors (Basel)       Date:  2017-09-12       Impact factor: 3.576

Review 3.  Heterogeneous 2D/3D photonic integrated microsystems.

Authors:  S J Ben Yoo; Binbin Guan; Ryan P Scott
Journal:  Microsyst Nanoeng       Date:  2016-08-01       Impact factor: 7.127

  3 in total

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