Literature DB >> 26227703

Microstructure Evolution with Direct Current Density on Electrodeposited Copper Films.

R F Santos1, F Viana1, P J Ferreira2.   

Abstract

Entities:  

Year:  2015        PMID： 26227703     DOI： 10.1017/S1431927615014038

Source DB:  PubMed          Journal:  Microsc Microanal        ISSN： 1431-9276            Impact factor:   4.127


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  1 in total

1.  Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects.

Authors:  Rúben F Santos; Bruno M C Oliveira; Liliane C G Savaris; Paulo J Ferreira; Manuel F Vieira
Journal:  Int J Mol Sci       Date:  2022-02-08       Impact factor: 5.923
  1 in total

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