| Literature DB >> 26089989 |
L D Sun1, M Hohage1, P Zeppenfeld1.
Abstract
We demonstrate that reflectance difference spectroscopy (RDS) is sensitive to defects induced by ion bombardment, located either in the topmost layer or in the subsurface region. Most importantly, these two kinds of defects can be spectrally discriminated, since the corresponding signatures in the RD spectrum arise from perturbations of different types of electronic states: The defects in the topmost surface layer mainly lead to a quenching of the optical anisotropy related to surface states, whereas the subsurface defects strongly affect the optical anisotropy originating from transitions between surface-modified bulk electronic states. Consequently, RDS can be used to simultaneously monitor the defects in the topmost surface layer and in the subsurface region in-situ during ion bombardment and thermal annealing. [Formula: see text] Characteristic RD spectra and the corresponding STM images for a Cu(110) substrate before and after healing of the subsurface defects.Entities:
Keywords: bulk defects; ion bombardment; metal surfaces; optical anisotropy; reflectance difference spectroscopy; surface defects
Year: 2013 PMID: 26089989 PMCID: PMC4461859 DOI: 10.1002/pssr.201307088
Source DB: PubMed Journal: Phys Status Solidi Rapid Res Lett ISSN: 1862-6254 Impact factor: 2.821
Figure 1(a) and (b) Real part of the RD spectra recorded before (thin lines) and after bombardment (thick lines) with 1000 eV Ar+ at room temperature (one hour) and at 45 K (30 min), respectively. (c) and (d) STM images of the ion bombarded surfaces in (a) and (b), respectively.
Figure 2(a) Real part of the RD spectrum after 30 min bombardment at 45 K (open circles) and annealing to 100 K, 200 K, 250 K, 300 K, 500 K, and 700 K. (b) Change of the RD intensity at 2.13 eV upon stepwise annealing. (c) and (d) STM images recorded after annealing at 200 K and 250 K, respectively.
Figure 3(a) Real part of the RD signal at 4.42 eV (the energy position marked by dashed line in Fig. 1a) recorded during annealing of a Cu(110) substrate which has been bombarded by 1000 eV Ar+ for one hour at room temperature. (b) and (c) STM images recorded at room temperature after the substrate has been annealed at 600 K and 700 K, respectively.