Selective etching of focused gallium ion beam implanted regions from silicon as a nanofabrication method.

A focused ion beam (FIB) is otherwise an efficient tool for nanofabrication of silicon structures but it suffers from the poor thermal stability of the milled surfaces caused by segregation of implanted gallium leading to severe surface roughening upon already slight annealing. In this paper we show that selective etching with KOH:H2O2 solutions removes the surface layer with high gallium concentration while blocking etching of the surrounding silicon and silicon below the implanted region. This remedies many of the issues associated with gallium FIB nanofabrication of silicon. After the gallium removal sub-nm surface roughness is retained even during annealing. As the etching step is self-limited to a depth of 25-30 nm for 30 keV ions, it is well suited for defining nanoscale features. In what is essentially a reversal of gallium resistless lithography, local implanted areas can be prepared and then subsequently etched away. Nanopore arrays and sub-100 nm trenches can be prepared this way. When protective oxide masks such as Al2O3 grown with atomic layer deposition are used together with FIB milling and KOH:H2O2 etching, ion-induced amorphization can be confined to sidewalls of milled trenches.