Literature DB >> 25890996

Bimodal sintered silver nanoparticle paste with ultrahigh thermal conductivity and shear strength for high temperature thermal interface material applications.

Mingyu Li1, Yong Xiao1, Zhihao Zhang1, Jie Yu1.   

Abstract

A bimodal silver nanoparticle (AgNP) paste has been synthesized via the simple ultrasonic mixing of two types of unimodal AgNPs (10 and 50 nm in diameter). By sintering this paste at 250 °C for 30 min, we obtained an ultrahigh thermal conductivity of 278.5 W m(-1) K(-1), approximately 65% of the theoretical value for bulk Ag. The shear strength before and after thermal cycling at 50-200 °C for 1000 cycles was approximately 41.80 and 28.75 MPa, respectively. The results show that this excellent performance is attributable to the unique sintered structures inside the bimodal AgNP paste, including its low but stable porosity and the high density coherent twins. In addition, we systematically discuss the sintering behavior of this paste, including the decomposition of the organic layers and the formation of the coherent twins. On the basis of these results, we confirm that our bimodal AgNP paste has excellent potential as a thermal interface material for high temperature power device applications.

Entities:  

Keywords:  bimodal size distribution; silver nanoparticles; sintering; thermal conductivity; thermal interface material; twin formation

Year:  2015        PMID: 25890996     DOI: 10.1021/acsami.5b01341

Source DB:  PubMed          Journal:  ACS Appl Mater Interfaces        ISSN: 1944-8244            Impact factor:   9.229


  9 in total

1.  Effectiveness of Oxygen during Sintering of Silver Thin Films Derived by Nanoparticle Ink.

Authors:  Feng Feng; Haofeng Hong; Xing Gao; Tian Ren; Yuan Ma; Pingfa Feng
Journal:  Nanomaterials (Basel)       Date:  2022-06-02       Impact factor: 5.719

2.  Thermally and photoinduced structural and chemical changes of a silver nanocube array on Au(111).

Authors:  Takeru Iwahori; Ayana Mizuno; Atsushi Ono; Yoichi Uehara; Satoshi Katano
Journal:  RSC Adv       Date:  2021-04-28       Impact factor: 4.036

3.  Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.

Authors:  M Y Li; H F Yang; Z H Zhang; J H Gu; S H Yang
Journal:  Sci Rep       Date:  2016-06-08       Impact factor: 4.379

4.  Ambient Aqueous-Phase Synthesis of Copper Nanoparticles and Nanopastes with Low-Temperature Sintering and Ultra-High Bonding Abilities.

Authors:  Yoichi Kamikoriyama; Hiroshi Imamura; Atsushi Muramatsu; Kiyoshi Kanie
Journal:  Sci Rep       Date:  2019-01-29       Impact factor: 4.379

5.  Ag-NPs/MWCNT composite-modified silver-epoxy paste with improved thermal conductivity.

Authors:  Yanchao Li; Guoyou Gan; Yukuan Huang; Xianglei Yu; Junhua Cheng; Chengbin Liu
Journal:  RSC Adv       Date:  2019-07-02       Impact factor: 3.361

Review 6.  Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics.

Authors:  Wenkui Xing; Yue Xu; Chengyi Song; Tao Deng
Journal:  Nanomaterials (Basel)       Date:  2022-09-27       Impact factor: 5.719

Review 7.  Thermal conductivity analysis and applications of nanocellulose materials.

Authors:  Kojiro Uetani; Kimihito Hatori
Journal:  Sci Technol Adv Mater       Date:  2017-11-03       Impact factor: 8.090

8.  Reactivity and Chemical Sintering of Carey Lea Silver Nanoparticles.

Authors:  Sergey Vorobyev; Elena Vishnyakova; Maxim Likhatski; Alexander Romanchenko; Ivan Nemtsev; Yuri Mikhlin
Journal:  Nanomaterials (Basel)       Date:  2019-10-26       Impact factor: 5.076

9.  Simulation and Experimental Study of the Multisized Silver Nanoparticles Sintering Process Based on Molecular Dynamics.

Authors:  Mingfei Gu; Tingting Liu; Xingzhi Xiao; Gang Li; Wenhe Liao
Journal:  Nanomaterials (Basel)       Date:  2022-03-21       Impact factor: 5.076

  9 in total

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