Literature DB >> 25874531

Inkjet printing of silver nanowire networks.

David J Finn1, Mustafa Lotya1, Jonathan N Coleman1.   

Abstract

The development of printed electronics will require the ability to deposit a wide range of nanomaterials using printing techniques. Here we demonstrate the controlled deposition of networks of silver nanowires in well-defined patterns by inkjet printing from an optimized isopropyl alcohol-diethylene glycol dispersion. We find that great care must be taken while producing the ink and during solvent evaporation. The resultant networks have good electrical properties, displaying sheet resistances as low as 8 Ω/□ and conductivities as high as 10(5) S/m. Such optimized performances were achieved for line widths of 1-10 mm and network thicknesses of 0.5-2 μm deposited from ∼10-20 passes while using processing temperatures of no more than 110 °C. Thin networks are semitransparent with dc to optical conductivity ratios of ∼40.

Entities:  

Keywords:  inkjet fabrication of Ag nanowires; nanomaterials; network; percolation; printed electronics; silver nanoink; silver nanowires; solution processing

Year:  2015        PMID: 25874531     DOI: 10.1021/acsami.5b01875

Source DB:  PubMed          Journal:  ACS Appl Mater Interfaces        ISSN: 1944-8244            Impact factor:   9.229


  15 in total

1.  A Simple Silver Nanowire Patterning Method Based on Poly(Ethylene Glycol) Photolithography and Its Application for Soft Electronics.

Authors:  Youngsang Ko; Jeonghun Kim; Dabum Kim; Yusuke Yamauchi; Jung Ho Kim; Jungmok You
Journal:  Sci Rep       Date:  2017-05-23       Impact factor: 4.379

2.  Gravure Printing of Water-based Silver Nanowire ink on Plastic Substrate for Flexible Electronics.

Authors:  Qijin Huang; Yong Zhu
Journal:  Sci Rep       Date:  2018-10-11       Impact factor: 4.379

Review 3.  Printed Electronics as Prepared by Inkjet Printing.

Authors:  Vimanyu Beedasy; Patrick J Smith
Journal:  Materials (Basel)       Date:  2020-02-04       Impact factor: 3.623

4.  Ultra-Uniform and Very Thin Ag Nanowires Synthesized via the Synergy of Cl-, Br- and Fe3+ for Transparent Conductive Films.

Authors:  Xiao-Ming Wang; Long Chen; Enrico Sowade; Raul D Rodriguez; Evgeniya Sheremet; Chun-Mei Yu; Reinhard R Baumann; Jin-Ju Chen
Journal:  Nanomaterials (Basel)       Date:  2020-01-29       Impact factor: 5.076

5.  Recycling silver nanoparticle debris from laser ablation of silver nanowire in liquid media toward minimum material waste.

Authors:  June Sik Hwang; Jong-Eun Park; Gun Woo Kim; Hyeono Nam; Sangseok Yu; Jessie S Jeon; Sanha Kim; Huseung Lee; Minyang Yang
Journal:  Sci Rep       Date:  2021-01-26       Impact factor: 4.379

6.  Inkjet Printing of PEDOT:PSS Based Conductive Patterns for 3D Forming Applications.

Authors:  Indranil Basak; Gudrun Nowicki; Bart Ruttens; Derese Desta; Jeroen Prooth; Manoj Jose; Steven Nagels; Hans-Gerd Boyen; Jan D'Haen; Mieke Buntinx; Wim Deferme
Journal:  Polymers (Basel)       Date:  2020-12-04       Impact factor: 4.329

7.  Inkjet Printing of Flexible Transparent Conductive Films with Silver Nanowires Ink.

Authors:  Xiaoli Wu; Shuyue Wang; Zhengwu Luo; Jiaxin Lu; Kaiwen Lin; Hui Xie; Yuehui Wang; Jing-Ze Li
Journal:  Nanomaterials (Basel)       Date:  2021-06-15       Impact factor: 5.076

Review 8.  Silver nanoparticle ink technology: state of the art.

Authors:  Krishna Rajan; Ignazio Roppolo; Annalisa Chiappone; Sergio Bocchini; Denis Perrone; Alessandro Chiolerio
Journal:  Nanotechnol Sci Appl       Date:  2016-01-11

9.  Roller-Induced Bundling of Long Silver Nanowire Networks for Strong Interfacial Adhesion, Highly Flexible, Transparent Conductive Electrodes.

Authors:  Yan-Ren Chen; Chien-Chong Hong; Tong-Miin Liou; Kuo Chu Hwang; Tzung-Fang Guo
Journal:  Sci Rep       Date:  2017-11-30       Impact factor: 4.379

Review 10.  Recent Advances in High-Throughput Nanomaterial Manufacturing for Hybrid Flexible Bioelectronics.

Authors:  Nathan Zavanelli; Jihoon Kim; Woon-Hong Yeo
Journal:  Materials (Basel)       Date:  2021-05-31       Impact factor: 3.623

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