Literature DB >> 25679952

Self-assembled supramolecular cages containing ruthenium(II) polypyridyl complexes.

Jiajia Yang1, Mohan Bhadbhade, William A Donald, Hasti Iranmanesh, Evan G Moore, Hong Yan, Jonathon E Beves.   

Abstract

Substitution-inert, redox- and photo-active ruthenium(II) complexes based on 2,2',6',2''-terpyridine ligands were self-assembled into discrete supramolecular cages via coordination to palladium(II) centres and characterised by NMR, ESI-MS and X-ray crystallography.

Entities:  

Mesh：

Substances：

Year:  2015        PMID： 25679952     DOI： 10.1039/c4cc10292d

Source DB:  PubMed          Journal:  Chem Commun (Camb)        ISSN： 1359-7345            Impact factor:   6.222


  4 in total

Review 1.  Beyond Platonic: How to Build Metal-Organic Polyhedra Capable of Binding Low-Symmetry, Information-Rich Molecular Cargoes.

Authors:  Charlie T McTernan; Jack A Davies; Jonathan R Nitschke
Journal:  Chem Rev       Date:  2022-04-18       Impact factor: 72.087

2.  Assembling Pentatopic Terpyridine Ligands with Three Types of Coordination Moieties into a Giant Supramolecular Hexagonal Prism: Synthesis, Self-Assembly, Characterization, and Antimicrobial Study.

Authors:  Heng Wang; Chung-Hao Liu; Kun Wang; Minghui Wang; Hao Yu; Sneha Kandapal; Robert Brzozowski; Bingqian Xu; Ming Wang; Shuai Lu; Xin-Qi Hao; Prahathees Eswara; Mu-Ping Nieh; Jianfeng Cai; Xiaopeng Li
Journal:  J Am Chem Soc       Date:  2019-09-25       Impact factor: 15.419

3.  Homochiral Self-Sorted and Emissive IrIII Metallo-Cryptophanes.

Authors:  Victoria E Pritchard; Diego Rota Martir; Samuel Oldknow; Shumpei Kai; Shuichi Hiraoka; Nikki J Cookson; Eli Zysman-Colman; Michaele J Hardie
Journal:  Chemistry       Date:  2017-04-20       Impact factor: 5.236

4.  Self-Assembly with 2,6-Bis(1-(pyridin-4-ylmethyl)-1H-1,2,3-triazol-4-yl)pyridine: Silver(I) and Iron(II) Complexes.

Authors:  Daniel A W Ross; Dan Preston; James D Crowley
Journal:  Molecules       Date:  2017-10-19       Impact factor: 4.411
  4 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.