Literature DB >> 25613710

Thermal transport: Cool electronics.

Jungwan Cho1, Kenneth E Goodson1.   

Abstract

Year:  2015        PMID： 25613710     DOI： 10.1038/nmat4194

Source DB:  PubMed          Journal:  Nat Mater        ISSN： 1476-1122            Impact factor:   43.841


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  4 in total

1.  Thermal conductivity spectroscopy technique to measure phonon mean free paths.

Authors:  A J Minnich; J A Johnson; A J Schmidt; K Esfarjani; M S Dresselhaus; K A Nelson; G Chen
Journal:  Phys Rev Lett       Date:  2011-08-25       Impact factor: 9.161

2.  Phonon black-body radiation limit for heat dissipation in electronics.

Authors:  J Schleeh; J Mateos; I Íñiguez-de-la-Torre; N Wadefalk; P A Nilsson; J Grahn; A J Minnich
Journal:  Nat Mater       Date:  2014-11-10       Impact factor: 43.841

3.  Graphene quilts for thermal management of high-power GaN transistors.

Authors:  Zhong Yan; Guanxiong Liu; Javed M Khan; Alexander A Balandin
Journal:  Nat Commun       Date:  2012-05-08       Impact factor: 14.919

4.  Universal phonon mean free path spectra in crystalline semiconductors at high temperature.

Authors:  Justin P Freedman; Jacob H Leach; Edward A Preble; Zlatko Sitar; Robert F Davis; Jonathan A Malen
Journal:  Sci Rep       Date:  2013-10-16       Impact factor: 4.379
  4 in total
  3 in total

1.  Swing-like pool boiling on nano-textured surfaces for microgravity applications related to cooling of high-power microelectronics.

Authors:  Sumit Sinha-Ray; Wenshuo Zhang; Barak Stoltz; Rakesh P Sahu; Suman Sinha-Ray; Alexander L Yarin
Journal:  NPJ Microgravity       Date:  2017-03-05       Impact factor: 4.415

2.  Improvement of ZrC/Zr Coating on the Interface Combination and Physical Properties of Diamond-Copper Composites Fabricated by Spark Plasma Sintering.

Authors:  Yanpeng Pan; Xinbo He; Shubin Ren; Mao Wu; Xuanhui Qu
Journal:  Materials (Basel)       Date:  2019-02-04       Impact factor: 3.623

3.  Effect of Thermal Conductive Fillers on the Flame Retardancy, Thermal Conductivity, and Thermal Behavior of Flame-Retardant and Thermal Conductive Polyamide 6.

Authors:  Fang Wang; Wenbo Shi; Yuliang Mai; Bing Liao
Journal:  Materials (Basel)       Date:  2019-12-09       Impact factor: 3.623
  3 in total

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