Surface relaxation of Cu(5 1 1).

The multilayer relaxation of the stepped Cu(5 1 1) surface has been studied by quantitative low-energy electron diffraction and analyzed using the CLEED program package. Relaxations with respect to the bulk interlayer spacing of 0.6934 Å are -9.5%, -10.4%, +8.2% and -1.8% for the first four interlayer spacings, respectively (negative sign corresponds to contraction). The relaxation sequence (- - + -…) is thus in agreement with the theoretical prediction. The deeper relaxations are damped in a non-uniform manner and the lateral relaxations are smaller than 2% of the lateral spacing. This result agrees well with theoretical studies of the same surface. The Pendry R-factor for the favored structure is 0.21.