Literature DB >> 25482984

Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics.

Yousef Farraj1, Michael Grouchko, Shlomo Magdassi.   

Abstract

Highly conductive copper patterns on low-cost flexible substrates are obtained by inkjet printing a metal complex based ink. Upon heating the ink, the soluble complex, which is composed of copper formate and 2-amino-2-methyl-1-propanol, decomposes under nitrogen at 140 °C and is converted to pure metallic copper. The decomposition process of the complex is investigated and a suggested mechanism is presented. The ink is stable in air for prolonged periods, with no sedimentation or oxidation problems, which are usually encountered in copper nanoparticle based inks.

Entities:  

Year:  2015        PMID: 25482984     DOI: 10.1039/c4cc08749f

Source DB:  PubMed          Journal:  Chem Commun (Camb)        ISSN: 1359-7345            Impact factor:   6.222


  6 in total

1.  Preparing of Highly Conductive Patterns on Flexible Substrates by Screen Printing of Silver Nanoparticles with Different Size Distribution.

Authors:  Jin Ding; Jun Liu; Qingyong Tian; Zhaohui Wu; Weijing Yao; Zhigao Dai; Li Liu; Wei Wu
Journal:  Nanoscale Res Lett       Date:  2016-09-20       Impact factor: 4.703

2.  Silver Eco-Solvent Ink for Reactive Printing of Polychromatic SERS and SPR Substrates.

Authors:  Mavlavi Dustov; Diana I Golovina; Alexander Yu Polyakov; Anastasia E Goldt; Andrei A Eliseev; Efim A Kolesnikov; Irina V Sukhorukova; Dmitry V Shtansky; Wolfgang Grünert; Anastasia V Grigorieva
Journal:  Sensors (Basel)       Date:  2018-02-09       Impact factor: 3.576

3.  Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions.

Authors:  Yingqiong Yong; Mai Thanh Nguyen; Hiroki Tsukamoto; Masaki Matsubara; Ying-Chih Liao; Tetsu Yonezawa
Journal:  Sci Rep       Date:  2017-03-24       Impact factor: 4.379

4.  Precursors for Atmospheric Plasma-Enhanced Sintering: Low-Temperature Inkjet Printing of Conductive Copper.

Authors:  Caroline E Knapp; Elizabeth A Metcalf; Shreya Mrig; Clara Sanchez-Perez; Samuel P Douglas; Patrick Choquet; Nicolas D Boscher
Journal:  ChemistryOpen       Date:  2018-08-31       Impact factor: 2.911

5.  Filtration-induced production of conductive/robust Cu films on cellulose paper by low-temperature sintering in air.

Authors:  Shintaro Sakurai; Yusuke Akiyama; Hideya Kawasaki
Journal:  R Soc Open Sci       Date:  2018-07-04       Impact factor: 2.963

6.  Copper conductive patterns through spray-pyrolysis of copper-diethanolamine complex solution.

Authors:  Jutamart Chotipanich; Suraya Hanim Abu Bakar; Amornchai Arponwichanop; Tetsu Yonezawa; Soorathep Kheawhom
Journal:  PLoS One       Date:  2018-07-03       Impact factor: 3.240

  6 in total

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