| Literature DB >> 25461586 |
M D Vaudin1, W A Osborn2, L H Friedman2, J M Gorham2, V Vartanian3, R F Cook2.
Abstract
Patterned SiGe thin film structures, heteroepitaxially deposited on Si substrates, are investigated as potential reference standards to establish the accuracy of high resolution electron backscattered diffraction (HR-EBSD) strain measurement methods. The proposed standards incorporate thin films of tetragonally distorted epitaxial Si₁-xGex adjacent to strain-free Si. Six films of three different nominal compositions (x=0.2, 0.3, and 0.4) and various thicknesses were studied. Film composition and out-of-plane lattice spacing measurements, by x-ray photoelectron spectroscopy and x-ray diffraction, respectively, provided independent determinations of film epitaxy and predictions of tetragonal strain for direct comparison with HR-EBSD strain measurements. Films assessed to be coherent with the substrate exhibited tetragonal strain values measured by HR-EBSD identical to those predicted from the composition and x-ray diffraction measurements, within experimental relative uncertainties of order 2%. Such films thus provide suitable prototypes for designing a strain reference standard. Published by Elsevier B.V.Entities:
Keywords: EBSD; Electron backscattered diffraction; Epitaxial SiGe–Si; Standard; Strain measurement
Year: 2014 PMID: 25461586 DOI: 10.1016/j.ultramic.2014.09.007
Source DB: PubMed Journal: Ultramicroscopy ISSN: 0304-3991 Impact factor: 2.689