Literature DB >> 25377127

Structurally engineered stackable and scalable 3D titanium-oxide switching devices for high-density nanoscale memory.

Daeseok Lee1, Jaesung Park, Jaehyuk Park, Jiyong Woo, Euijun Cha, Sangheon Lee, Kibong Moon, Jeonghwan Song, Yunmo Koo, Hyunsang Hwang.   

Abstract

A 3D high-density switching device is realized utilizing titanium oxide, which is the most optimum material, but which is not practically demonstrated yet. The 1S1R (one ReRAM with the developed switching device) exhibits memory characteristics with a significantly suppressed sneak current, which can be used to realize high-density ReRAM applications.
© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Entities:  

Keywords:  3D structure; cross-point array; metal-insulator transition; non-volatilememory; titanium oxide; two-terminal switch

Year:  2014        PMID: 25377127     DOI: 10.1002/adma.201403675

Source DB:  PubMed          Journal:  Adv Mater        ISSN: 0935-9648            Impact factor:   30.849


  1 in total

1.  Memory window engineering of Ta2O5-x oxide-based resistive switches via incorporation of various insulating frames.

Authors:  Ah Rahm Lee; Gwang Ho Baek; Tae Yoon Kim; Won Bae Ko; Seung Mo Yang; Jongmin Kim; Hyun Sik Im; Jin Pyo Hong
Journal:  Sci Rep       Date:  2016-07-25       Impact factor: 4.379

  1 in total

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