Literature DB >> 25249883

Dichlorido{(2E)-2-[phen-yl(pyridin-2-yl)methyl-idene]hydrazinecarbo-thio-amide}cadmium(II) methanol monosolvate.

Ambili A Aravindakshan1, V Seena1, M Sithambaresan2, M R Prathapachandra Kurup1.   

Abstract

In the title compound, [Cdn class="Chemical">Cl2(C13H12N4S)]·CH3OH, the coord-ination geometry of the Cd(II) ion is slightly distorted square-pyramidal, as indicated by the τ index of 0.36 (8). The S atom, two N atoms from the pyridyl-azomethine moiety and one of the Cl atoms comprise the basal plane, while the other Cl atom occupies the apical position. The hydrazinecarbo-thio-amide moiety adopts an E conformation with respect to the azomethine bond. The solvate mol-ecule in the crystal lattice plays a major role in inter-connecting adjacent mol-ecules by means of O-H⋯Cl and N-H⋯O hydrogen-bonding inter-actions. A supra-molecular three-dimensional architecture is sustained in terms of further N-H⋯Cl and C-H⋯Cl hydrogen-bonding inter-actions.

Entities:  

Keywords:  crystal structure

Year:  2014        PMID: 25249883      PMCID: PMC4158520          DOI: 10.1107/S1600536814015694

Source DB:  PubMed          Journal:  Acta Crystallogr Sect E Struct Rep Online        ISSN: 1600-5368


  3 in total

1.  A short history of SHELX.

Authors:  George M Sheldrick
Journal:  Acta Crystallogr A       Date:  2007-12-21       Impact factor: 2.290

2.  Novel heterocyclic thiosemicarbazones derivatives as colorimetric and "turn on" fluorescent sensors for fluoride anion sensing employing hydrogen bonding.

Authors:  S L Ashok Kumar; M Saravana Kumar; P B Sreeja; A Sreekanth
Journal:  Spectrochim Acta A Mol Biomol Spectrosc       Date:  2013-05-07       Impact factor: 4.098

3.  Bis{μ-2-[bis-(pyridin-2-yl)methyl-idene]hydrazinecarbothio-amidato}bis-[bromido-copper(II)] methanol disolvate.

Authors:  Roji J Kunnath; M Sithambaresan; M R Prathapachandra Kurup; Aiswarya Natarajan; A Ambili Aravindakshan
Journal:  Acta Crystallogr Sect E Struct Rep Online       Date:  2012-02-29
  3 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.