Literature DB >> 25180569

Thin-film copper indium gallium selenide solar cell based on low-temperature all-printing process.

Manjeet Singh1, Jinting Jiu, Tohru Sugahara, Katsuaki Suganuma.   

Abstract

In the solar cell field, development of simple, low-cost, and low-temperature fabrication processes has become an important trend for energy-saving and environmental issues. Copper indium gallium selenide (CIGS) solar cells have attracted much attention due to the high absorption coefficient, tunable band gap energy, and high efficiency. However, vacuum and high-temperature processing in fabrication of solar cells have limited the applications. There is a strong need to develop simple and scalable methods. In this work, a CIGS solar cell based on all printing steps and low-temperature annealing is developed. CIGS absorber thin film is deposited by using dodecylamine-stabilized CIGS nanoparticle ink followed by printing buffer layer. Silver nanowire (AgNW) ink and sol-gel-derived ZnO precursor solution are used to prepare a highly conductive window layer ZnO/[AgNW/ZnO] electrode with a printing method that achieves 16 Ω/sq sheet resistance and 94% transparency. A CIGS solar cell based on all printing processes exhibits efficiency of 1.6% with open circuit voltage of 0.48 V, short circuit current density of 9.7 mA/cm(2), and fill factor of 0.34 for 200 nm thick CIGS film, fabricated under ambient conditions and annealed at 250 °C.

Entities:  

Keywords:  Ag nanowires; CIGS nanoparticles; ZnO sol−gel; low temperature; printing process

Year:  2014        PMID: 25180569     DOI: 10.1021/am504509r

Source DB:  PubMed          Journal:  ACS Appl Mater Interfaces        ISSN: 1944-8244            Impact factor:   9.229


  1 in total

1.  Draw-spun, photonically annealed Ag fibers as alternative electrodes for flexible CIGS solar cells.

Authors:  Yujing Liu; Simon Zeder; Sen Lin; Romain Carron; Günter Grossmann; Sami Bolat; Shiro Nishiwaki; Frank Clemens; Thomas Graule; Ayodhya N Tiwari; Hui Wu; Yaroslav E Romanyuk
Journal:  Sci Technol Adv Mater       Date:  2018-11-30       Impact factor: 8.090

  1 in total

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