Graphene nanoribbons (GNRs) are promising candidates for next generation integrated circuit (IC) components; this fact motivates exploration of the relationship between crystallographic structure and transport of graphene patterned at IC-relevant length scales (<10 nm). We report on the controlled fabrication of pristine, freestanding GNRs with widths as small as 0.7 nm, paired with simultaneous lattice-resolution imaging and electrical transport characterization, all conducted within an aberration-corrected transmission electron microscope. Few-layer GNRs very frequently formed bonded-bilayers and were remarkably robust, sustaining currents in excess of 1.5 μA per carbon bond across a 5 atom-wide ribbon. We found that the intrinsic conductance of a sub-10 nm bonded bilayer GNR scaled with width as GBL(w) ≈ 3/4(e(2)/h)w, where w is the width in nanometers, while a monolayer GNR was roughly five times less conductive. Nanosculpted, crystalline monolayer GNRs exhibited armchair-terminated edges after current annealing, presenting a pathway for the controlled fabrication of semiconducting GNRs with known edge geometry. Finally, we report on simulations of quantum transport in GNRs that are in qualitative agreement with the observations.
Graphene nanoribbons (GNRs) are promising candidates for next generation integrated circuit (IC) components; this fact motivates exploration of the relationship between crystallographic structure and transport of graphene patterned at IC-relevant length scales (<10 nm). We report on the controlled fabrication of pristine, freestanding GNRs with widths as small as 0.7 nm, paired with simultaneous lattice-resolution imaging and electrical transport characterization, all conducted within an aberration-corrected transmission electron microscope. Few-layer GNRs very frequently formed bonded-bilayers and were remarkably robust, sustaining currents in excess of 1.5 μA per carbon bond across a 5 atom-wide ribbon. We found that the intrinsic conductance of a sub-10 nm bonded bilayer GNR scaled with width as GBL(w) ≈ 3/4(e(2)/h)w, where w is the width in nanometers, while a monolayer GNR was roughly five times less conductive. Nanosculpted, crystalline monolayer GNRs exhibited armchair-terminated edges after current annealing, presenting a pathway for the controlled fabrication of semiconducting GNRs with known edge geometry. Finally, we report on simulations of quantum transport in GNRs that are in qualitative agreement with the observations.
Graphene nanoribbons (GNRs)
derived from wafer-scale material are attractive candidates for next-generation
integrated circuit (IC) components, for example, on-chip electrical
interconnects[1] or transistor channels.[2−4] Despite advances in growth of single-crystal graphene by chemical
vapor deposition (CVD),[5,6] the intrinsic properties of patterned
GNRs are expected to be degraded by unintentional doping[7−9] and chemical contaminants[10−12] associated with the fabrication
process and the substrate. Furthermore, at IC-relevant length scales
below 10 nm, edge terminations should play an important role, as they
are predicted to determine the band structure[13,14] and electron transport[15] of GNRs. However,
experimental verification of these predictions remains a challenge
because it requires combining atomic-resolution fabrication and structure
determination with transport measurements.The electron beam
of a transmission electron microscope (TEM) can
be focused into a spot of a few nanometers in diameter. If its energy
is larger than ∼80 keV,[16] it can
be used to displace carbon atoms from chosen areas in graphene.[17−20] Nanosculpting of isolated graphene devices was demonstrated within
a TEM but the crystallographic orientation and edge structure could
not be determined due to resolution limitations.[17] Crack formation induced by electrical biasing within an
AC-TEM was used to study the morphology of narrow graphene constrictions[21,22] but this approach does not provide a pathway for deterministic patterning.
To date, controlled patterning in an aberration-corrected TEM has
not been utilized to define device structures that could then be biased
in situ. A clear correlation between the subnanometer structure and
electrical properties of systematically patterned GNRs could provide
greater insight into graphene’s relevance for future nanoelectronics.Here we report the fabrication, lattice-resolution imaging, and
electrical characterization of pristine mono- and few-layer GNRs with
widths below 10 nm, performed in situ within an AC-TEM. Bonded bilayer
GNRs were controllably fabricated with widths as low as 0.7 nm, and
they supported current densities in excess of 4 × 109 A/cm2, 3 orders of magnitude greater than state-of-the-art
interconnects. Monolayer GNRs formed by nanosculpting followed by
current annealing were consistently observed to have armchair-terminated
edges, presenting a pathway for fabricating edge-specific GNRs. We
found that the GNR conductance scaled approximately as GBL(w) ≈ 3/4 (e2/h)w for a bonded-bilayer
GNR and GML(w) ≈ 3/20 (e2/h)w for a monolayer GNR, where w is the width in nanometers. The high conductance of the bonded-bilayer
GNR is attributed to sp2-bonded edges that stabilize the
structure[23−25] and distribute current into additional conduction
channels. Quantum transport simulations of the conductance were in
qualitative agreement with the measurements. The work represents a
systematic approach to study the interplay between atomic structure
and electronic properties of GNRs and provides a pathway for future
studies in novel two-dimensional materials such as dichalcogenides
and nitrides.Device layout and current annealing procedure. (a) Optical
micrograph
of TEM-compatible chip with multiple electrodes converging onto a
silicon nitride membrane. (b) SEM micrograph of suspended 500 nm wide
graphene ribbon. (c) Time evolution of device resistance during current
annealing. Inset: Corresponding current versus bias voltage measurement
for the same device. (d) Current-bias voltage sweeps for a single
device after multiple annealing steps, which cause the resistance
to decrease from 104 to 10 kΩ.Details of the fabrication process can be found in the Supporting Information. Figure 1a shows an optical micrograph of a TEM-compatible chip with
multiple source-drain electrodes that contact an array of two-terminal
devices on a 100 nm-thick SiN membrane
(Figure 1a). Each device consisted of a 500
nm wide strip of graphene bridging an electrode pair with a graphene
region suspended over a 150 nm slit (Figures 1b and 2a). Devices were based on both few-
and monolayer graphene grown by atmospheric pressure CVD.[26] Samples were mounted on a TEM holder with electrical
feedthroughs (Protochips Inc.) to allow for in situ electrical transport
measurements. TEM experiments were performed in either a FEI-Titan
with corrected spherical aberrations, operating with a beam accelerating
voltage of 80 or 300 keV, or in a JEOL 2010F operating at 200 kV (in
this case experiments relied on a homemade TEM holder with electrical
feedthroughs[17]).
Figure 1
Device layout and current annealing procedure. (a) Optical
micrograph
of TEM-compatible chip with multiple electrodes converging onto a
silicon nitride membrane. (b) SEM micrograph of suspended 500 nm wide
graphene ribbon. (c) Time evolution of device resistance during current
annealing. Inset: Corresponding current versus bias voltage measurement
for the same device. (d) Current-bias voltage sweeps for a single
device after multiple annealing steps, which cause the resistance
to decrease from 104 to 10 kΩ.
Figure 2
Nanosculpting of suspended graphene using a focused TEM beam. (a)
TEM image of initial free-standing 500 nm wide GNR contacted by Au
electrodes. Arrows indicate the edges of the ribbon. (b) Corresponding
high-resolution TEM micrograph of a monolayer GNR after cleaning,
showing a nearly pristine surface. (c) Electron diffraction pattern
taken from a 100 nm-diameter area of a clean GNR. (d) Time evolution
of GNR resistance during sculpting. Steplike increases in resistance
represent periods of sculpting (narrowing of the GNR) while plateaus
represent pauses in sculpting when the beam is blanked. Inset: Schematic
of sculpting technique.[17] (e) TEM micrograph
of graphene after nanosculpting with the sculpted region highlighted
in red and indicated by arrows. (f) Two-terminal GNR resistance as
a function of width (w) for w >
10 nm with solid curves showing fits of the form RTOT= RC+ RM/w with w measured
in nanometers.
Once the devices
were in the TEM, a slow voltage ramp (typically
0–2.8 V at 5 mV/s) was used to induce Joule heating that removed
contaminants associated with lithographic processing. The electrical
resistance decreased from ∼100 kΩ for as-fabricated devices
to ∼10 kΩ after the cleaning step (Figure 1c,d), which was attributed to removal of resist residue and
improved contact resistance due to heating. After this step, the sample
surface was very clean, and electron diffraction data were consistent
with single crystal graphene grains with dimensions of at least 100
nm in diameter (Figure 2a–c) for both
mono- and few-layer samples (see Figure S1 in the Supporting Information).Cleaned devices were further
patterned by nanosculpting using the
TEM electron beam. The electron beam (with beam energy of 200 or 300
keV, well above 80 keV, the threshold for knock-on damage in graphitic
materials[16,27,28]) was focused
to a spot (diameter <5 nm) and then moved to progressively sculpt
the suspended graphene to widths less than 10 nm by ejecting carbon
atoms from the lattice (inset of Figure 2d).
During nanosculpting, the voltage bias was held at 1–3 V to
induce Joule heating that prevented electron-beam induced hydrocarbon
contamination[29] and damage accumulation[30] and allowed for healing of atomic defects,[31] so that the few-layer (Figure 3a–d) and monolayer (Figure 4a–d) GNRs remained highly crystalline.[17,32,33] This procedure was used to successively
narrow the width of the GNRs from 500 nm to ca. 10 nm. An example
of in situ electrical measurement during the nanosculpting procedure
is shown in Figure 2d. The sample resistance
increased as the GNR width was reduced during nanosculpting (Figure 2e). Plateaus in the resistance indicate a pause
in sculpting when the GNR was imaged. With this patterning technique,
we measured the resistance as a function of width for few-layer and
monolayer GNRs over the range 10–500 nm (Figure 2f). For each sample, the data were well fit by the form appropriate
for an Ohmic conductor in series with a contact resistance: RTOT= RC+ ρ/w, where RC is the contact resistance, w is the width
of the GNR, and ρ is a fit parameter with units of resistance
multiplied by length. The contact resistance is assumed to reflect
the resistance of the wiring, the metal–graphene interface,
and wider graphene regions away from the GNR. The contact resistances
inferred from the fits were 9.7 ± 0.2 and 11.4 ± 0.3 kΩ
for few-layer GNRs and 18.9 ± 0.5 and 24.4 ± 0.5 kΩ
for monolayer GNRs, consistent with the expectation that few-layer
graphene structures should be less resistive, all other aspects being
similar. The structural and electrical analysis of mono- and few-layer
GNR devices with widths less than 10 nm are discussed in the following
paragraphs.
Figure 3
Layer-by-layer electrical
stress-induced fracturing of a GNR consisting
of two stacked, bonded graphene bilayers and correlated transport
properties. (a) High-resolution micrograph of the GNR with bonded
bilayers of width w = 3.2 and 1.2 nm. (b) Narrowing
of the GNR. (c) Image of the GNR immediately after breaking of the
top-bonded bilayer. (d) Final structure, showing a single bonded-bilayer
GNR with a width of 0.7 nm, immediately before the GNR ruptured. Images
(b–d) are 1.5× larger than (a). (e) TEM micrograph of
a trilayer graphene sheet (top) and a single-layer graphene sheet
(bottom) separated by a single sp2-bonded edge. Number
of layers is extracted from the 2D FFT of each region of the image.
(f) Few-layer GNR resistance as a function of width and the best fit
to the data (black line) RTOT= RC+ ρ/w with w the width in nanometers. Here RC = 58 kΩ and ρ = 36 kΩ-nm. Inset: Time
evolution of GNR conductance with step-like drops indicating the breaking
of bonded bilayers until eventual failure (at t =
0 s).
Figure 4
Edge morphology and transport of single-layer
GNRs. (a) TEM micrograph
of a single-layer GNR edge immediately after nanosculpting, showing
a curved edge. An isolated monolayer graphene island is observed on
an underlying monolayer. The 2D FFTs for vacuum (top), underlying
monolayer, and the island region are provided. (b) Evolution of (a)
after current annealing showing the formation of armchair edges along
the top edge of the GNR. Corresponding 2D FFT is to the right. (c)
The lower edge of the GNR with corresponding 2D FFT to the right,
indicative of an armchair edge geometry. (d) TEM image of an isolated
single-layer GNR (w = 1.3 nm). (e) Resistance as
a function of width for monolayer GNR. Solid black curve is a fit
to the form RTOT= RC+ ρ/w with RC = 145 kΩ and ρ = 207 kΩ-nm.
Inset: Time evolution of monolayer GNR conductance until device breakdown
at t = 0 s.
Nanosculpting of suspended graphene using a focused TEM beam. (a)
TEM image of initial free-standing 500 nm wide GNR contacted by Au
electrodes. Arrows indicate the edges of the ribbon. (b) Corresponding
high-resolution TEM micrograph of a monolayer GNR after cleaning,
showing a nearly pristine surface. (c) Electron diffraction pattern
taken from a 100 nm-diameter area of a clean GNR. (d) Time evolution
of GNR resistance during sculpting. Steplike increases in resistance
represent periods of sculpting (narrowing of the GNR) while plateaus
represent pauses in sculpting when the beam is blanked. Inset: Schematic
of sculpting technique.[17] (e) TEM micrograph
of graphene after nanosculpting with the sculpted region highlighted
in red and indicated by arrows. (f) Two-terminal GNR resistance as
a function of width (w) for w >
10 nm with solid curves showing fits of the form RTOT= RC+ RM/w with w measured
in nanometers.Nanosculpting was not
utilized for narrowing GNRs to widths below
10 nm, because it was desirable to have uninterrupted imaging as the
sample width was reduced. To enable this, sub-10 nm dimensions were
achieved by application of electrical stress to GNRs, which led to
a reduction of width due to changes in the atomic lattice.[34] Sputtering of atoms can also occur at the beam
energies used, however the current density of the beam alone cannot
account for the structural changes observed during the experiment
(see Supporting Information for calculation
of sputtering rate). In these experiments, few-layer GNRs were observed
to consist of stacks of bonded graphene bilayers, which exhibit a
dark edge contrast (Figures 3a–d and S2 in the Supporting Information) consistent with previous observations on heated graphene sheets.[23,34] Figure 3e presents supporting evidence that
the dark edges seen in few-layer GNRs represent a bonded edge. Corresponding
two-dimensional fast Fourier transform (2D FFT), showing the spatial
frequencies present in the image and their orientations, were taken
for the regions above (Figure 3e right inset)
and below (Figure 3e left inset) the dark line
in Figure 3e. The lower region in the image
is a monolayer sheet (signified by a set of 6-fold peaks representing
1/0.213 nm–1 spatial frequencies and therefore {1–100}
planes) while the top contains three layers (indicated by three rotated
sets of 6-fold peaks in the FFT). The single dark interface represents
a bonded edge, delineating the mono- and trilayer regions (for higher
resolution, see Figure S3 in the Supporting Information). In contrast, free edges of graphene monolayers showed low contrast
in high-resolution TEM images (Figure 4a–d),
enabling the two cases to be distinguished.The 2D FFT of TEM
images were also used to determine the crystallographic
orientation of individual graphene layers and layer edges. Consider,
for example, the GNR of Figure 3a, which consisted
of a stack of two bonded bilayers with minimum widths of 3.2 and 1.2
nm. After the narrower bilayer ruptured (Figure 3c), the structure of the wider bilayer was determined; the measured
width of the bilayer and the rotation between the layers of 27°
inferred from the 2D FFT were used to create an atomistic model (top
part of Figure 3a), which was then used for
simulations discussed below. On the basis of the geometry, transport
occurred parallel to the [21̅1̅0] direction for one layer
and close to the [101̅0] direction for the second. Immediately
before the bilayer GNR ruptured, its width was 0.7 nm (Figure 3d), corresponding to roughly the distance of three
(011̅0) lattice planes, and it supported a current density of
4 × 109 A/cm2, or 1.5 μA per carbon
bond. Video 1 in the Supporting Information provides the entire TEM series.Monolayer GNRs presented a
curved edge immediately after nanosculpting
(Figure 4a) that recrystallized into a faceted
edge after current annealing (Figure 4b). In
this case, the 2D FFT was used to determine the GNR structure as well
as the edge orientation before (Figure 4a)
and after current annealing (Figure 4b,c).
From this analysis, we conclude that the lattice orientation is unchanged
by current annealing, and that the straight edges present after current
annealing are oriented along the armchair lattice direction for both
the top (Figure 4b) and bottom edge (Figure 4c). This finding is consistent with theoretical
predictions[29,33,35] that the armchair edge configuration has the lowest energy per atom.
The approach of nanosculpting followed by current annealing thus provides
a pathway to fabrication of semiconducting monolayer GNRs with well-defined
(armchair) edge geometry. Along with the structural analysis provided
above, the focus of the current work is the width dependence of the
GNR conductance as well as the maximum sustained current density.Electrical stress was used to narrow monolayer GNRs to widths below
10 nm, similar to the narrowing of few-layer GNR discussed above.
A monolayer GNR of w = 1.3 nm is shown in Figure 4d; this image was taken at low beam current densities
to reduce knock-on damage. For this very narrow monolayer GNR, lattice
resolution was not achieved due to mechanical instability of the sample,
however we expect that armchair edges dominate, as found for wider
monolayer GNRs (Figure 4b).Layer-by-layer electrical
stress-induced fracturing of a GNR consisting
of two stacked, bonded graphene bilayers and correlated transport
properties. (a) High-resolution micrograph of the GNR with bonded
bilayers of width w = 3.2 and 1.2 nm. (b) Narrowing
of the GNR. (c) Image of the GNR immediately after breaking of the
top-bonded bilayer. (d) Final structure, showing a single bonded-bilayer
GNR with a width of 0.7 nm, immediately before the GNR ruptured. Images
(b–d) are 1.5× larger than (a). (e) TEM micrograph of
a trilayer graphene sheet (top) and a single-layer graphene sheet
(bottom) separated by a single sp2-bonded edge. Number
of layers is extracted from the 2D FFT of each region of the image.
(f) Few-layer GNR resistance as a function of width and the best fit
to the data (black line) RTOT= RC+ ρ/w with w the width in nanometers. Here RC = 58 kΩ and ρ = 36 kΩ-nm. Inset: Time
evolution of GNR conductance with step-like drops indicating the breaking
of bonded bilayers until eventual failure (at t =
0 s).Edge morphology and transport of single-layer
GNRs. (a) TEM micrograph
of a single-layer GNR edge immediately after nanosculpting, showing
a curved edge. An isolated monolayer graphene island is observed on
an underlying monolayer. The 2D FFTs for vacuum (top), underlying
monolayer, and the island region are provided. (b) Evolution of (a)
after current annealing showing the formation of armchair edges along
the top edge of the GNR. Corresponding 2D FFT is to the right. (c)
The lower edge of the GNR with corresponding 2D FFT to the right,
indicative of an armchair edge geometry. (d) TEM image of an isolated
single-layer GNR (w = 1.3 nm). (e) Resistance as
a function of width for monolayer GNR. Solid black curve is a fit
to the form RTOT= RC+ ρ/w with RC = 145 kΩ and ρ = 207 kΩ-nm.
Inset: Time evolution of monolayer GNR conductance until device breakdown
at t = 0 s.The four-layer GNR shown in Figure 3a–e
was put under electrical stress until failure, as described above.
The electrical conductance and width of the GNR were monitored through
the process (see Figure 3f). A jump in resistance
is observed at a width of 1.2 nm, corresponding to the breaking of
the first bonded bilayer (seen in Figure 3c).
We fit the resistance to the form RTOT= RC+ ρ/w, excluding the resistance spike region (black curve in
Figure 3f) and found best fit values RC = 58 ± 1 kΩ and ρ = 36 ±
1 kΩ-nm. The same fit was found to apply in both the four-layer
and bilayer region, suggesting that conduction was predominantly via
the wider bilayer (for that reason, we refer to the sample as a bonded-bilayer
from this point forward). For the monolayer case, a similar fitting
procedure was used to analyze the data (black curve in Figure 4e), and the best fit parameters were RC = 145 ± 6 kΩ and ρ = 207 ± 20
kΩ-nm. For both samples, the inferred contact resistance in
the sub-10 nm regime was significantly larger than that found for
the measurements summarized in Figure 2f. In
each case, the intrinsic conductance of the GNR as a function of width
was calculated (i.e., ignoring the contact resistance) and found to
scale linearly with width (measured in nanometers); for the bonded-bilayer
GNR, GBL(w) ≈
0.75 (e2/h)w[nm], while the intrinsic conductance of the monolayer GNR was approximately
five times lower, GML(w) ≈ 0.15 (e2/h)w[nm] (see Figure 5a). The
lower inferred value of RC in the bonded-bilayer
GNR is ascribed to increased conduction paths in the multilayer graphene
leads and reduced scattering associated with sp2 edge bonding
compared to free edges of the monolayer. The enhanced conductance
of the bonded-bilayer sample suggests that similar devices would be
more suitable for use as on-chip interconnects. The bonded-bilayer
GNR also sustained a very large maximum current density of 4.2 ×
109 A/cm2, 3 orders of magnitude than that of
state-of-the-art interconnects, even when its width was just 0.7 nm.
Figure 5
Conductance scaling of GNRs. (a) Measured conductance
as a function
of width for few-layer (black squares) and monolayer (red circles)
GNRs, after subtraction of the best fit contact resistance. The black
line is a fit of the form GFL(w) ≈ 0.75 (e2/h)w[nm], and the red line is a fit of the
form GML(w) = 0.15 (e2/h)w[nm].
(b) Ball and stick models of armchair-edge monolayer (top) and bonded
bilayer (bottom) GNR devices used for quantum transport calculations.
(c) Conductance as a function of width for simulated and measured
GNRs. Black (red) data points are from simulations of the conductance
of bonded bilayer (armchair-edge monolayer) GNR with dashed lines
as corresponding linear fits. Solid lines represent linear fits to
the experimental data, as reproduced from panel (a).
Quantum conductance calculations were conducted and compared to
the measurements in order to develop a quantitative understanding
of the intrinsic properties of bonded-bilayer and monolayer GNRs.
The simulations were performed on systems with geometries inferred
from experimental TEM images. The simulation included a channel region
ca. 5 nm in length, placed between wide (ca. 30 nm) nanoribbons serving
as leads (see Supporting Information for
simulation methodology). On the basis of experimentally obtained structural
information (Figures 3a and 4a,b), the channel constriction region consisted of either
a bonded bilayer with a layer twist of 26.4° or monolayer with
an armchair edge (Figure 5b). Any difference
between the twist angle in the simulation and that determined from
TEM data (27°) is not expected to lead to a significant effect
since the variation of conductance with twist is weak when close to
either AA or AB stacking (i.e., θ ∼ 0 or θ ∼30°).[36]For the case of a semi-infinite monolayer
GNR, the conductance
as a function of carrier energy, G(E), increases in a stepwise manner as additional conduction channels
are accessed (Figure S4 of the Supporting Information). In contrast, for a monolayer GNR contacted by wider leads as in
the experiment, G(E) exhibits oscillations
at low carrier energies due to interference and scattering at the
constriction.[37] For the bonded bilayer
case, the number of channels is effectively doubled, and the average
conductance increases. Conductance oscillations again occur at low
energies due to interference effects. Above a carrier energy threshold,
oscillations are suppressed due to increased conduction via interband
tunneling.The width-dependent conductance at constant carrier
energy G(E = E0, w) for an ideal, semi-infinite GNR exhibits a series of
quantized
conductance steps as the width narrows, consistent with limiting the
number of accessible channels (Figure S5 in the Supporting Information). To compare with experiment, the carrier
energy was taken to be 0.6 eV corresponding to the bias voltage used
in the experiments. For the case of a GNR constriction between wider
leads, the steps are washed out by contact effects (i.e., reflection
and scattering), and G(w) exhibits
a near-linear behavior, consistent with the experiment. In this case, GBL(w) ∼ 1.1 (e2/h)w for bonded bilayer GNRs and GML(w) ∼
0.4 (e2/h)w for monolayer GNRs (Figure 5c). In the simulation,
the conductance drops to zero for w < 2 nm due
to a quantum-confinement energy gap that exceeds the carrier energy.The agreement between experiment and simulation is very good. In
both experiment and simulation, bonded-bilayer GNRs exhibit higher
conductance than monolayer GNRs due to the presence of additional
conduction channels and reduced carrier scattering in the bilayer.
The measured enhancement for bilayer GNRs is a factor of 5, while
the enhancement in simulation is a factor of 3. Surprisingly, the
experiments did not show conductance suppression or other evidence
of an energy gap in samples with w < 2 nm as predicted
theoretically. This can be attributed to several factors. First, the
chemical potential could lie outside the energy gap due to unintentional
carrier doping, allowing for conduction even at narrow widths. Alternatively,
the explanation may lie in transport processes not included in the
simulation, for example, inelastic phonon scattering effects or tunneling
through the narrowest part of the constriction where the energy gap
is present. It has been predicted that different contact angles and
junctions can modulate the ribbon to have near perfect transmissions
or zero conductance,[36,38,39] which could account for the discrepancy from theory because a 90°
contact angle is assumed. Finally, mechanical stress in the system
could lead to the tuning of the energy gap,[40] which was not accounted for in the simulation. Future work implementing
a third terminal to modulate the chemical potential will provide greater
insight on the electronic structure of these GNRs and enable enhanced
comparison with computational work.In summary, we have demonstrated
the controlled fabrication of
mono- and few-layer GNRs with correlated lattice resolution imaging
and electrical biasing, down to widths of 0.7 nm. We measured the
electrical properties of GNRs for widths less than 15 nm and found
that conductance scaled approximately as GFL(w) ≈ 0.75 (e2/h)w[nm] for a bilayer GNR and GML(w) ≈ 0.15 (e2/h)w[nm]
for a monolayer GNR. The high conductance in few-layer GNRs is enabled
by their bonded edges, which provided structural stability and additional
conduction channels, allowing for sustained currents in excess of
1.5 μA per carbon bond. Monolayer GNRs formed armchair-terminated
edges after current annealing, presenting a pathway for fabricating
edge-specific GNRs. The methodology presented here should enable future
experiments to correlate sample conductance with atomic geometry in
emerging two-dimensional materials such as layered transition metaldichalcogenides and nitrides.Conductance scaling of GNRs. (a) Measured conductance
as a function
of width for few-layer (black squares) and monolayer (red circles)
GNRs, after subtraction of the best fit contact resistance. The black
line is a fit of the form GFL(w) ≈ 0.75 (e2/h)w[nm], and the red line is a fit of the
form GML(w) = 0.15 (e2/h)w[nm].
(b) Ball and stick models of armchair-edge monolayer (top) and bonded
bilayer (bottom) GNR devices used for quantum transport calculations.
(c) Conductance as a function of width for simulated and measured
GNRs. Black (red) data points are from simulations of the conductance
of bonded bilayer (armchair-edge monolayer) GNR with dashed lines
as corresponding linear fits. Solid lines represent linear fits to
the experimental data, as reproduced from panel (a).
Authors: Xiaoting Jia; Mario Hofmann; Vincent Meunier; Bobby G Sumpter; Jessica Campos-Delgado; José Manuel Romo-Herrera; Hyungbin Son; Ya-Ping Hsieh; Alfonso Reina; Jing Kong; Mauricio Terrones; Mildred S Dresselhaus Journal: Science Date: 2009-03-27 Impact factor: 47.728
Authors: Jamie H Warner; Mark H Rümmeli; Ling Ge; Thomas Gemming; Barbara Montanari; Nicholas M Harrison; Bernd Büchner; G Andrew D Briggs Journal: Nat Nanotechnol Date: 2009-08-02 Impact factor: 39.213
Authors: Paul Masih Das; Gopinath Danda; Andrew Cupo; William M Parkin; Liangbo Liang; Neerav Kharche; Xi Ling; Shengxi Huang; Mildred S Dresselhaus; Vincent Meunier; Marija Drndić Journal: ACS Nano Date: 2016-05-24 Impact factor: 15.881
Authors: Jinglei Ping; Ramya Vishnubhotla; Jin Xi; Pedro Ducos; Jeffery G Saven; Renyu Liu; Alan T Charlie Johnson Journal: ACS Nano Date: 2018-04-17 Impact factor: 15.881
Authors: Julio A Rodríguez-Manzo; Zhengqing John Qi; Alexander Crook; Jae-Hyuk Ahn; A T Charlie Johnson; Marija Drndić Journal: ACS Nano Date: 2016-04-18 Impact factor: 15.881
Authors: Jinglei Ping; Katherine W Pulsipher; Ramya Vishnubhotla; Jose A Villegas; Tacey L Hicks; Stephanie Honig; Jeffery G Saven; Ivan J Dmochowski; A T Charlie Johnson Journal: Chem Sci Date: 2017-06-13 Impact factor: 9.825