Literature DB >> 24899382

High-density soft-matter electronics with micron-scale line width.

B Arda Gozen1, Arya Tabatabai, O Burak Ozdoganlar, Carmel Majidi.   

Abstract

A method to produce soft and stretchable microelectronics composed of a liquid-phase Gallium-Indium alloy with micron-scale circuit features is introduced. Microchannels are molded onto the surface of a poly(dimethylsiloxane) (PDMS) elastomer and filled with EGaIn using a micro-transfer deposition step that exploits the unique wetting properties of EGaIn in air. The liquid-filled channels function as stretchable circuit wires or capacitor electrodes with a 2 μm linewidth and 1 μm spacing.
© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Entities:  

Keywords:  eutectic gallium indium; liquid phase micro-electronics; micro-transfer printing; soft electronics; stretchable electronics

Year:  2014        PMID： 24899382     DOI： 10.1002/adma.201400502

Source DB:  PubMed          Journal:  Adv Mater        ISSN： 0935-9648            Impact factor:   30.849


  14 in total

1.  Printing low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen.

Authors:  Lei Wang; Jing Liu
Journal:  Proc Math Phys Eng Sci       Date:  2014-12-08       Impact factor: 2.704

2.  Wearable Bioelectronics for Chronic Wound Management.

Authors:  Canran Wang; Ehsan Shirzaei Sani; Wei Gao
Journal:  Adv Funct Mater       Date:  2021-12-26       Impact factor: 19.924

3.  Liquid on Paper: Rapid Prototyping of Soft Functional Components for Paper Electronics.

Authors:  Yu Long Han; Hao Liu; Cheng Ouyang; Tian Jian Lu; Feng Xu
Journal:  Sci Rep       Date:  2015-07-01       Impact factor: 4.379

4.  Mechanical Fracturing of Core-Shell Undercooled Metal Particles for Heat-Free Soldering.

Authors:  Simge Çınar; Ian D Tevis; Jiahao Chen; Martin Thuo
Journal:  Sci Rep       Date:  2016-02-23       Impact factor: 4.379

Review 5.  Fabrication Approaches to Interconnect Based Devices for Stretchable Electronics: A Review.

Authors:  Steven Nagels; Wim Deferme
Journal:  Materials (Basel)       Date:  2018-03-03       Impact factor: 3.623

Review 6.  Attributes, Fabrication, and Applications of Gallium-Based Liquid Metal Particles.

Authors:  Yiliang Lin; Jan Genzer; Michael D Dickey
Journal:  Adv Sci (Weinh)       Date:  2020-04-22       Impact factor: 16.806

Review 7.  Recent Advancements in Liquid Metal Flexible Printed Electronics: Properties, Technologies, and Applications.

Authors:  Xuelin Wang; Jing Liu
Journal:  Micromachines (Basel)       Date:  2016-11-30       Impact factor: 2.891

8.  Aerosol Spray Deposition of Liquid Metal and Elastomer Coatings for Rapid Processing of Stretchable Electronics.

Authors:  Taylor V Neumann; Berra Kara; Yasaman Sargolzaeiaval; Sooik Im; Jinwoo Ma; Jiayi Yang; Mehmet C Ozturk; Michael D Dickey
Journal:  Micromachines (Basel)       Date:  2021-02-01       Impact factor: 2.891

9.  Emerging applications of liquid metals featuring surface oxides.

Authors:  Michael D Dickey
Journal:  ACS Appl Mater Interfaces       Date:  2014-10-06       Impact factor: 9.229

10.  Nanofabrication for all-soft and high-density electronic devices based on liquid metal.

Authors:  Min-Gu Kim; Devin K Brown; Oliver Brand
Journal:  Nat Commun       Date:  2020-02-21       Impact factor: 14.919
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