Literature DB >> 24677188

Thin films with ultra-low thermal expansion.

Namiko Yamamoto1, Eleftherios Gdoutos, Risaku Toda, Victor White, Harish Manohara, Chiara Daraio.   

Abstract

Ultra-low coefficient of thermal expansion (CTE) is an elusive property, and narrow temperature ranges of operation and poor mechanical properties limit the use of conventional materials with low CTE. We structured a periodic micro-array of bi-metallic cells to demonstrate ultra-low effective CTE with a wide temperature range. These engineered tunable CTE thin film can be applied to minimize thermal fatigue and failure of optics, semiconductors, biomedical sensors, and solar energy applications.
© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Entities:  

Keywords:  metals; microstructures; thermal stability; thin films; ultra-low thermal expansion

Mesh:

Substances:

Year:  2014        PMID: 24677188     DOI: 10.1002/adma.201304997

Source DB:  PubMed          Journal:  Adv Mater        ISSN: 0935-9648            Impact factor:   30.849


  4 in total

1.  Micro-structured medium with large isotropic negative thermal expansion.

Authors:  Luigi Cabras; Michele Brun; Diego Misseroni
Journal:  Proc Math Phys Eng Sci       Date:  2019-12-18       Impact factor: 2.704

2.  Structurally Efficient Three-dimensional Metamaterials with Controllable Thermal Expansion.

Authors:  Hang Xu; Damiano Pasini
Journal:  Sci Rep       Date:  2016-10-10       Impact factor: 4.379

3.  Encoding kirigami bi-materials to morph on target in response to temperature.

Authors:  Lu Liu; Chuan Qiao; Haichao An; Damiano Pasini
Journal:  Sci Rep       Date:  2019-12-20       Impact factor: 4.379

4.  Graphene Origami with Highly Tunable Coefficient of Thermal Expansion.

Authors:  Duc Tam Ho; Harold S Park; Sung Youb Kim; Udo Schwingenschlögl
Journal:  ACS Nano       Date:  2020-06-15       Impact factor: 15.881

  4 in total

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