Literature DB >> 24668053

Superomedial submucosal partial arytenoidectomy for improved posterior glottic closure: surgical technique and case presentation.

Jonathan J Romak1, Dale C Ekbom, Amy M Saleh, Diana M Orbelo, Nicolas E Maragos.   

Abstract

OBJECTIVE: Endoscopic medial partial arytenoidectomy has been described previously for expansion of the posterior glottic airway in bilateral vocal fold paralysis. Superomedial submucosal partial arytenoidectomy (SSPA), a modification of this technique, can improve glottic closure in the setting of an obstructing anteromedially prolapsed arytenoid. We present our surgical technique and a case example. METHODS AND
RESULTS: A 45-year-old man presented with dysphonia attributable to unilateral true vocal fold paralysis. Laryngoscopy revealed right true vocal fold atrophy and an anteriorly prolapsed right arytenoid cartilage preventing posterior glottic closure during adduction. Right SSPA and ipsilateral vocal fold injection augmentation were performed without complication. One-month and 11-month postoperative evaluations showed marked improvement in voice, with complete glottic closure. Quality-of-life assessment and patient report showed a durable result at 50 months.
CONCLUSION: SSPA may be a valuable technique in the management of breathy dysphonia associated with posterior glottic gap and other sequelae of the malpositioned arytenoid.

Entities:  

Keywords:  dysphonia; endoscopic arytenoidectomy; glottic closure; prolapsed arytenoid; unilateral vocal fold paralysis; voice disorder

Mesh:

Year:  2014        PMID: 24668053     DOI: 10.1177/0003489414526367

Source DB:  PubMed          Journal:  Ann Otol Rhinol Laryngol        ISSN: 0003-4894            Impact factor:   1.547


  1 in total

1.  Superomedial partial arytenoidectomy for voice improvement by correction of posterior glottic insufficiency.

Authors:  Rutger Mahieu; Derrek Heuveling; Hans Mahieu
Journal:  Eur Arch Otorhinolaryngol       Date:  2020-02-18       Impact factor: 2.503

  1 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.