Literature DB >> 24189538

Printed circuit boards: a review on the perspective of sustainability.

André Canal Marques1, José-María Cabrera, Célia de Fraga Malfatti.   

Abstract

Modern life increasingly requires newer equipments and more technology. In addition, the fact that society is highly consumerist makes the amount of discarded equipment as well as the amount of waste from the manufacture of new products increase at an alarming rate. Printed circuit boards, which form the basis of the electronics industry, are technological waste of difficult disposal whose recycling is complex and expensive due to the diversity of materials and components and their difficult separation. Currently, printed circuit boards have a fixing problem, which is migrating from traditional Pb-Sn alloys to lead-free alloys without definite choice. This replacement is an attempt to minimize the problem of Pb toxicity, but it does not change the problem of separation of the components for later reuse and/or recycling and leads to other problems, such as temperature rise, delamination, flaws, risks of mechanical shocks and the formation of "whiskers". This article presents a literature review on printed circuit boards, showing their structure and materials, the environmental problem related to the board, some the different alternatives for recycling, and some solutions that are being studied to reduce and/or replace the solder, in order to minimize the impact of solder on the printed circuit boards.
Copyright © 2013 Elsevier Ltd. All rights reserved.

Entities:  

Keywords:  Environmental problem; Printed circuit boards; Solder replacement; Waste electrical and electronic equipment

Mesh:

Substances:

Year:  2013        PMID: 24189538     DOI: 10.1016/j.jenvman.2013.10.003

Source DB:  PubMed          Journal:  J Environ Manage        ISSN: 0301-4797            Impact factor:   6.789


  6 in total

1.  Past and emerging topics related to electronic waste management: top countries, trends, and perspectives.

Authors:  Daniel Fernandes Andrade; João Paulo Romanelli; Edenir Rodrigues Pereira-Filho
Journal:  Environ Sci Pollut Res Int       Date:  2019-04-18       Impact factor: 4.223

Review 2.  Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

Authors:  Abhishek Kumar Awasthi; Xianlai Zeng; Jinhui Li
Journal:  Environ Sci Pollut Res Int       Date:  2016-09-28       Impact factor: 4.223

3.  Life cycle assessment of a printed circuit board manufacturing plant in Turkey.

Authors:  Elif Ozkan; Nilay Elginoz; Fatos Germirli Babuna
Journal:  Environ Sci Pollut Res Int       Date:  2017-09-29       Impact factor: 4.223

4.  A comparative life cycle assessment of stretchable and rigid electronics: a case study of cardiac monitoring devices.

Authors:  S Kokare; F M A Asif; G Mårtensson; S Shoaib-Ul-Hasan; A Rashid; M Roci; N Salehi
Journal:  Int J Environ Sci Technol (Tehran)       Date:  2021-05-26       Impact factor: 3.519

5.  Leaching of Copper Contained in Waste Printed Circuit Boards, Using the Thiosulfate-Oxygen System: A Kinetic Approach.

Authors:  Eleazar Salinas-Rodríguez; Juan Hernández-Ávila; Eduardo Cerecedo-Sáenz; Alberto Arenas-Flores; Maria A Veloz-Rodríguez; Norman Toro; Maria Del P Gutiérrez-Amador; Otilio A Acevedo-Sandoval
Journal:  Materials (Basel)       Date:  2022-03-22       Impact factor: 3.623

6.  Bottom-Up Fabrication of Protein Nanowires via Controlled Self-Assembly of Recombinant Geobacter Pilins.

Authors:  K M Cosert; Angelines Castro-Forero; Rebecca J Steidl; Robert M Worden; G Reguera
Journal:  mBio       Date:  2019-12-10       Impact factor: 7.867

  6 in total

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