Literature DB >> 24160688

Copper shell networks in polymer composites for efficient thermal conduction.

Seunggun Yu1, Jang-Woo Lee, Tae Hee Han, Cheolmin Park, Youngdon Kwon, Soon Man Hong, Chong Min Koo.   

Abstract

Thermal management of polymeric composites is a crucial issue to determine the performance and reliability of the devices. Here, we report a straightforward route to prepare polymeric composites with Cu thin film networks. Taking advantage of the fluidity of polymer melt and the ductile properties of Cu films, the polymeric composites were created by the Cu metallization of PS bead and the hot press molding of Cu-plated PS beads. The unique three-dimensional Cu shell-networks in the PS matrix demonstrated isotropic and ideal conductive performance at even extremely low Cu contents. In contrast to the conventional simple melt-mixed Cu beads/PS composites at the same concentration of 23.0 vol %, the PS composites with Cu shell networks indeed revealed 60 times larger thermal conductivity and 8 orders of magnitude larger electrical conductivity. Our strategy offers a straightforward and high-throughput route for the isotropic thermal and electrical conductive composites.

Entities:  

Year:  2013        PMID: 24160688     DOI: 10.1021/am4030406

Source DB:  PubMed          Journal:  ACS Appl Mater Interfaces        ISSN: 1944-8244            Impact factor:   9.229


  3 in total

1.  Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires.

Authors:  Dianyu Shen; Zhaolin Zhan; Zhiduo Liu; Yong Cao; Li Zhou; Yuanli Liu; Wen Dai; Kazuhito Nishimura; Chaoyang Li; Cheng-Te Lin; Nan Jiang; Jinhong Yu
Journal:  Sci Rep       Date:  2017-06-01       Impact factor: 4.379

2.  Tailoring Thermal Transport Properties of Graphene Paper by Structural Engineering.

Authors:  Li Ren; Mengjie Wang; Shaorong Lu; Lulu Pan; Zhongqiang Xiong; Zuocai Zhang; Qingyuan Peng; Yuqi Li; Jinhong Yu
Journal:  Sci Rep       Date:  2019-03-14       Impact factor: 4.379

3.  Engineered Cu-PEN Composites at the Nanoscale: Preparation and Characterisation.

Authors:  Jana Pryjmaková; Mariia Hryhoruk; Martin Veselý; Petr Slepička; Václav Švorčík; Jakub Siegel
Journal:  Nanomaterials (Basel)       Date:  2022-04-05       Impact factor: 5.076

  3 in total

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