| Literature DB >> 24060995 |
Shih-kang Lin1, Chao-kuei Yeh, Wei Xie, Yu-chen Liu, Masahiro Yoshimura.
Abstract
Soldering is an ancient process, having been developed 5000 years ago. It remains a crucial process with many modern applications. In electronic devices, electric currents pass through solder joints. A new physical phenomenon--the supersaturation of solders under high electric currents--has recently been observed. It involves (1) un-expected supersaturation of the solder matrix phase, and (2) the formation of unusual "ring-shaped" grains. However, the origin of these phenomena is not yet understood. Here we provide a plausible explanation of these phenomena based on the changes in the phase stability of Pb-Sn solders. Ab initio-aided CALPHAD modeling is utilized to translate the electric current-induced effect into the excess Gibbs free energies of the phases. Hence, the phase equilibrium can be shifted by current stressing. The Pb-Sn phase diagrams with and without current stressing clearly demonstrate the change in the phase stabilities of Pb-Sn solders under current stressing.Entities:
Year: 2013 PMID: 24060995 PMCID: PMC3781394 DOI: 10.1038/srep02731
Source DB: PubMed Journal: Sci Rep ISSN: 2045-2322 Impact factor: 4.379
Figure 1Ab initio-aided CALPHAD calculated Pb-Sn binary phase diagrams without current stressing and with experimental data151617181920212223 superimposed.
Figure 2Ab initio-aided CALPHAD calculated Pb-Sn binary phase diagrams without and with current stressing with respect to the current densities of 5.0 × 103, 1.0 × 104, 2.5 × 104, 5.0 × 104, and 7.5 × 104 A/cm2.
Figure 3Schematic diagrams of the microstructural evolutions of the Pb-Sn alloys under current stressing.
Figure 4Saturabilities of Sn in the Pb-rich FCC phase (upper half) and Pb in the Sn-rich BCT phase (lower half) of the Pb-Sn binary system at temperatures from 25 to 180°C.