Literature DB >> 24056305

Density functional study of Cu(2+)-phenylalanine complex under micro-solvation environment.

Aravindhan Ganesan1, Jens Dreyer, Feng Wang, Jaakko Akola, Julen Larrucea.   

Abstract

We present an atomistic study carried out using density functional calculations including structural relaxations and Car-Parrinello Molecular Dynamics (CPMD) simulations, aiming to investigate the structures of phenylalanine-copper (II) ([Phe-Cu](2+)) complexes and their micro-solvation processes. The structures of the [Phe-Cu](2+) complex with up to four water molecules are optimized using the B3LYP/6-311++G** model in gas phase to identify the lowest energy structures at each degree of solvation (n=0-4). It is found that the phenylalanine appears to be in the neutral form in isolated and mono-hydrated complexes, but in the zwitterionic form in other hydrated complexes (with n≥2). The most stable structures of the complexes suggest that the Cu(2+)-π interactions are not dominant in the [Phe-Cu](2+) complexes. The present CPMD simulations of the lowest energy micro-hydrated [Phe-Cu](2+) complexes also reveal that the maximum coordination of Cu(2+) in the presence of the Phe ligand does not exceed four: the oxygen atoms from three water molecules and one carboxyl oxygen atom of Phe. Any excess water molecules will migrate to the second solvation shell. Moreover a unique structural motif, (N)H···O(3)···H2O-Cu(2+) is present in the lowest energy complexes, which is recognized to be significant in stabilizing the structures of the complexes. Extensively rich information of the structures, energetics, hydrogen bonds and dynamics of the lowest energy complexes are discussed.
Copyright © 2013 Elsevier Inc. All rights reserved.

Entities:  

Keywords:  CPMD; DFT; Micro-solvation; Phenylalanine-copper (II) complex

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Year:  2013        PMID: 24056305     DOI: 10.1016/j.jmgm.2013.08.015

Source DB:  PubMed          Journal:  J Mol Graph Model        ISSN: 1093-3263            Impact factor:   2.518


  1 in total

1.  Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components.

Authors:  Nabi S Shabanov; Kamil Sh Rabadanov; Sagim I Suleymanov; Akhmed M Amirov; Abdulgalim B Isaev; Dinara S Sobola; Eldar K Murliev; Gulnara A Asvarova
Journal:  Materials (Basel)       Date:  2021-04-26       Impact factor: 3.623

  1 in total

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