Literature DB >> 23857724

Non-porous low-k dielectric films based on a new structural amorphous fluoropolymer.

Chao Yuan1, Kaikai Jin, Kai Li, Shen Diao, Jiawei Tong, Qiang Fang.   

Abstract

A non-porous and amorphous fluoropolymer PFN with low dielectric constant of 2.33 and dielectric loss less than 1.2 × 10(-3) is reported here. PFN also exhibits good mechanical properties and high thermostability. This study is a new example of a fully dense material showing a low k value and having good thermo/mechanical properties.
Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Entities:  

Keywords:  dielectric constant; fluoropolymers; insulators; low k materials; thin solid films

Year:  2013        PMID: 23857724     DOI: 10.1002/adma.201302021

Source DB:  PubMed          Journal:  Adv Mater        ISSN: 0935-9648            Impact factor:   30.849


  3 in total

1.  Biorenewable rosin derived benzocyclobutene resin: a thermosetting material with good hydrophobicity and low dielectric constant.

Authors:  Fei Fu; Dan Wang; Minggui Shen; Shibin Shang; Zhanqian Song; Jie Song
Journal:  RSC Adv       Date:  2019-09-20       Impact factor: 4.036

2.  Free Volume Effect via Various Chemical Structured Monomers on Adhesion Property and Relative Permittivity in Acrylic Pressure Sensitive Adhesives.

Authors:  Jung-Hun Lee; Ji-Soo Kim; Hyun-Joong Kim; Kyujong Park; Jungwoo Moon; Jinyoung Lee; Youngju Park
Journal:  Polymers (Basel)       Date:  2020-11-10       Impact factor: 4.329

3.  Preparation and Characterization of Intrinsic Low-κ Polyimide Films.

Authors:  Yu Sun; Tao Li; Haiyang Dai; Manman Wang; Renzhong Xue; Jing Chen; Dewei Liu
Journal:  Polymers (Basel)       Date:  2021-11-29       Impact factor: 4.329

  3 in total

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