Literature DB >> 23523907

Novel application of the nonmetallic fraction of the recycled printed circuit boards as a toxic heavy metal adsorbent.

Pejman Hadi1, Ping Gao, John P Barford, Gordon McKay.   

Abstract

Printed circuit boards (PCBs) constitute one of the major sources of toxicity in landfill areas throughout the world. Hence, PCB recycling and separation of its metallic and nonmetallic components has been considered a major ecological breakthrough. Many studies focus on the metallic fraction of the PCBs due to its economic benefits whereas the nonmetallic powder (NMP) has been left isolated. In this work, the feasibility of using NMP as an adsorbent to remove charged toxic heavy metal ions have been studied and its efficiency has been compared with two widely-used commercial adsorbents. The results indicated that the virgin NMP material has no adsorption capacity, while the application of an activation stage to modify the NMP process has a significant effect on its porosity and thus adsorption capacity. The Cu and Pb removal capacity of the activated sample (A-NMP) at a pH level of 4 was 3 mmol and 3.4 mmol per gram of the adsorbent, respectively, which was considerably higher than the commercial ones.
Copyright © 2013 Elsevier B.V. All rights reserved.

Entities:  

Mesh:

Substances:

Year:  2013        PMID: 23523907     DOI: 10.1016/j.jhazmat.2013.02.037

Source DB:  PubMed          Journal:  J Hazard Mater        ISSN: 0304-3894            Impact factor:   10.588


  2 in total

Review 1.  Heavy metal-induced oxidative stress on seed germination and seedling development: a critical review.

Authors:  Mihiri Seneviratne; Nishanta Rajakaruna; Muhammad Rizwan; H M S P Madawala; Yong Sik Ok; Meththika Vithanage
Journal:  Environ Geochem Health       Date:  2017-07-12       Impact factor: 4.609

2.  Genome-wide locus-specific DNA methylation repatterning may facilitate rapid evolution of mercury resistance in rice.

Authors:  Weixuan Cong; Ning Li; Jinbin Wang; Ying Kang; Yiling Miao; Chunming Xu; Ziqi Wang; Tongtong Liu; Lei Gong; Bao Liu; Xiufang Ou
Journal:  Genes Genomics       Date:  2021-11-30       Impact factor: 1.839

  2 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.