Literature DB >> 23422310

Effect of electrode materials on AlN-based bipolar and complementary resistive switching.

Chao Chen1, Shuang Gao, Guangsheng Tang, Huadong Fu, Guangyue Wang, Cheng Song, Fei Zeng, Feng Pan.   

Abstract

We report the complementary resistive switching (CRS) behaviors in aluminum nitride (AlN)-based memory devices as the promising new material system for large-scale integration of passive crossbar arrays. By utilizing different electrodes (Cu, Pt, and TiN), CRS characteristics are demonstrated in both TiN/AlN/Cu/AlN/TiN electrochemical metallization cells and Pt/AlN/TiN/AlN/Pt ionic resistive switching systems. The instability of Pt/AlN/Cu/AlN/Pt based CRS is explained by the relatively small reset voltage caused by the thermal effects enhanced reset process in the corresponding bipolar resistive switching element. It is concluded that the prerequisite for reliable and stable CRS is that the reset voltage of the bipolar resistive switching element must be much larger than half of the set voltage.

Entities:  

Year:  2013        PMID: 23422310     DOI: 10.1021/am303128h

Source DB:  PubMed          Journal:  ACS Appl Mater Interfaces        ISSN: 1944-8244            Impact factor:   9.229


  4 in total

1.  Configurable switching behavior in polymer-based resistive memories by adopting unique electrode/electrolyte arrangement.

Authors:  Karthik Krishnan; Shaikh Mohammad Tauquir; Saranyan Vijayaraghavan; Ramesh Mohan
Journal:  RSC Adv       Date:  2021-07-02       Impact factor: 4.036

2.  Implementation of Complete Boolean Logic Functions in Single Complementary Resistive Switch.

Authors:  Shuang Gao; Fei Zeng; Minjuan Wang; Guangyue Wang; Cheng Song; Feng Pan
Journal:  Sci Rep       Date:  2015-10-21       Impact factor: 4.379

3.  Highly stable ITO/Zn2TiO4/Pt resistive random access memory and its application in two-bit-per-cell.

Authors:  Shi-Xiang Chen; Sheng-Po Chang; Wei-Kang Hsieh; Shoou-Jinn Chang; Chih-Chien Lin
Journal:  RSC Adv       Date:  2018-05-15       Impact factor: 3.361

4.  Integration scheme of nanoscale resistive switching memory using bottom-up processes at room temperature for high-density memory applications.

Authors:  Un-Bin Han; Jang-Sik Lee
Journal:  Sci Rep       Date:  2016-07-01       Impact factor: 4.379

  4 in total

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