Fabrication of complex 3-dimensional patterned structures on a ∼10 nm scale from a single master pattern by secondary sputtering lithography.

We describe a highly efficient method for fabricating a variety of complex 3D nano-patterns from a single master pattern using secondary sputtering lithography, which is a 10 nm scale patterning method that we have developed. A rapid etching rate in the bottom part of the PS pillar during the RIE process can produce various nanostructure shapes and the PS residual layer thickness can influence various feature dimensions, due to the controlled RIE time leading to different PS layer thicknesses. This technique provides a highly effective method for producing various complex 3D patterns from a single master pattern. Thus, this method can serve as a new procedure for the cost-effective mass production of complex nanoscale patterns with high resolution.