Literature DB >> 23235859

Computer engineering: Feeling the heat.

Philip Ball.   

Abstract

Year:  2012        PMID： 23235859     DOI： 10.1038/492174a

Source DB:  PubMed          Journal:  Nature        ISSN： 0028-0836            Impact factor:   49.962


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  5 in total

Review 1.  Beyond Moore's technologies: operation principles of a superconductor alternative.

Authors:  Igor I Soloviev; Nikolay V Klenov; Sergey V Bakurskiy; Mikhail Yu Kupriyanov; Alexander L Gudkov; Anatoli S Sidorenko
Journal:  Beilstein J Nanotechnol       Date:  2017-12-14       Impact factor: 3.649

2.  Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration.

Authors:  Ming-Ding Li; Xiao-Quan Shen; Xin Chen; Jia-Ming Gan; Fang Wang; Jian Li; Xiao-Liang Wang; Qun-Dong Shen
Journal:  Nat Commun       Date:  2022-10-04       Impact factor: 17.694

3.  Reversible logic gate using adiabatic superconducting devices.

Authors:  N Takeuchi; Y Yamanashi; N Yoshikawa
Journal:  Sci Rep       Date:  2014-09-15       Impact factor: 4.379

4.  In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon.

Authors:  Onur Tokel; Ahmet Turnali; Ghaith Makey; Parviz Elahi; Tahir Çolakoğlu; Emre Ergeçen; Özgün Yavuz; René Hübner; Mona Zolfaghari Borra; Ihor Pavlov; Alpan Bek; Raşit Turan; Denizhan Koray Kesim; Serhat Tozburun; Serim Ilday; F Ömer Ilday
Journal:  Nat Photonics       Date:  2017-09-29       Impact factor: 38.771

5.  Heat dissipation in quasi-ballistic single-atom contacts at room temperature.

Authors:  Makusu Tsutsui; Yu-Chang Chen
Journal:  Sci Rep       Date:  2019-12-10       Impact factor: 4.379
  5 in total

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