| Literature DB >> 22755646 |
M Smolka1, C Motz, T Detzel, W Robl, T Griesser, A Wimmer, G Dehm.
Abstract
The temperature dependent mechanical properties of the metallization of electronic power devices are studied in tensile tests on micron-sized freestanding copper beams at temperatures up to 400 °C. The experiments are performed in situ in a scanning electron microscope. This allows studying the micromechanical processes during the deformation and failure of the sample at different temperatures.Entities:
Year: 2012 PMID： 22755646 DOI： 10.1063/1.4725529
Source DB: PubMed Journal: Rev Sci Instrum ISSN： 0034-6748 Impact factor: 1.523