Literature DB >> 22676159

Replacing -CH2CH2- with -CONH- does not significantly change rates of charge transport through Ag(TS)-SAM//Ga2O3/EGaIn junctions.

Martin M Thuo1, William F Reus, Felice C Simeone, Choongik Kim, Michael D Schulz, Hyo Jae Yoon, George M Whitesides.   

Abstract

This paper describes physical-organic studies of charge transport by tunneling through self-assembled monolayers (SAMs), based on systematic variations of the structure of the molecules constituting the SAM. Replacing a -CH(2)CH(2)- group with a -CONH- group changes the dipole moment and polarizability of a portion of the molecule and has, in principle, the potential to change the rate of charge transport through the SAM. In practice, this substitution produces no significant change in the rate of charge transport across junctions of the structure Ag(TS)-S(CH(2))(m)X(CH(2))(n)H//Ga(2)O(3)/EGaIn (TS = template stripped, X = -CH(2)CH(2)- or -CONH-, and EGaIn = eutectic alloy of gallium and indium). Incorporation of the amide group does, however, increase the yields of working (non-shorting) junctions (when compared to n-alkanethiolates of the same length). These results suggest that synthetic schemes that combine a thiol group on one end of a molecule with a group, R, to be tested, on the other (e.g., HS~CONH~R) using an amide-based coupling provide practical routes to molecules useful in studies of molecular electronics.

Entities:  

Mesh:

Substances:

Year:  2012        PMID: 22676159     DOI: 10.1021/ja301778s

Source DB:  PubMed          Journal:  J Am Chem Soc        ISSN: 0002-7863            Impact factor:   15.419


  6 in total

1.  Probing Charge Transport through Peptide Bonds.

Authors:  Joseph M Brisendine; Sivan Refaely-Abramson; Zhen-Fei Liu; Jing Cui; Fay Ng; Jeffrey B Neaton; Ronald L Koder; Latha Venkataraman
Journal:  J Phys Chem Lett       Date:  2018-02-01       Impact factor: 6.475

2.  Bottom-electrode induced defects in self-assembled monolayer (SAM)-based tunnel junctions affect only the SAM resistance, not the contact resistance or SAM capacitance.

Authors:  C S Suchand Sangeeth; Li Jiang; Christian A Nijhuis
Journal:  RSC Adv       Date:  2018-05-30       Impact factor: 3.361

3.  Mechanical Fracturing of Core-Shell Undercooled Metal Particles for Heat-Free Soldering.

Authors:  Simge Çınar; Ian D Tevis; Jiahao Chen; Martin Thuo
Journal:  Sci Rep       Date:  2016-02-23       Impact factor: 4.379

4.  Printable logic circuits comprising self-assembled protein complexes.

Authors:  Xinkai Qiu; Ryan C Chiechi
Journal:  Nat Commun       Date:  2022-04-28       Impact factor: 17.694

5.  Transition voltages respond to synthetic reorientation of embedded dipoles in self-assembled monolayers.

Authors:  Andrii Kovalchuk; Tarek Abu-Husein; Davide Fracasso; David A Egger; Egbert Zojer; Michael Zharnikov; Andreas Terfort; Ryan C Chiechi
Journal:  Chem Sci       Date:  2015-10-22       Impact factor: 9.825

6.  Correlating the Influence of Disulfides in Monolayers across Photoelectron Spectroscopy Wettability and Tunneling Charge-Transport.

Authors:  Sumit Kumar; Saurabh Soni; Wojciech Danowski; Carlijn L F van Beek; Ben L Feringa; Petra Rudolf; Ryan C Chiechi
Journal:  J Am Chem Soc       Date:  2020-08-24       Impact factor: 15.419

  6 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.