| Literature DB >> 22673473 |
Atsushi Mine1, Jan De Munck, Marcio V Cardoso, Kirsten L Van Landuyt, André Poitevin, Takuo Kuboki, Yasuhiro Yoshida, Kazuomi Suzuki, Bart Van Meerbeek.
Abstract
The purpose of this study was to evaluate if a low-shrinking composite can improve the bonding effectiveness of adhesives in highly constrained conditions. A low-shrinking composite ('els-extra low shrinkage', Saremco) was bonded in standardized occlusal Class-I cavities using a three-step ('cmf', Saremco) and a two-step etch-and-rinse adhesive ('XP Bond', Dentsply). Both adhesives were also combined with a conventional composite ('Z100', 3M ESPE). Half of the restored cavities were exposed to 20,000 thermo-cycles. 3-way ANOVA revealed a significant effect for the factors 'adhesive' and 'composite' (both p<0.0001), but not for 'thermo-cycling' (p=0.994). Significantly higher bond strengths were recorded for the low-shrinking composite than for the control composite, using either of the adhesives. The low-shrinking composite in combination with the three-step etch-and-rinse adhesive performed best in the high C-factor Class-I cavity. The two-step etch-and-rinse adhesive suffered strongly from polymerization-shrinkage stress, which could be partially restored by using the low-shrinking composite.Mesh:
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Year: 2012 PMID: 22673473 DOI: 10.4012/dmj.2011-261
Source DB: PubMed Journal: Dent Mater J ISSN: 0287-4547 Impact factor: 2.102