Literature DB >> 22540491

How does adhesion induce the formation of telephone cord buckles?

Jean-Yvon Faou1, Guillaume Parry, Sergey Grachev, Etienne Barthel.   

Abstract

Compressively stressed thin films with low adhesion frequently buckle and delaminate simultaneously into telephone cords. Although these buckles have been studied for decades, no complete understanding of their propagation has so far been presented. In this study, we have coupled a nonlinear plate deformation with a cohesive zone model to simulate the kinematics of a propagating telephone cord buckle in very close agreement with experimental observations. Proper inclusion of the dependence of an adhesion upon the mode mixity proved to be central to the success of the approach. The clarification of the mechanism promises better understanding of buckle morphologies.

Year:  2012        PMID: 22540491     DOI: 10.1103/PhysRevLett.108.116102

Source DB:  PubMed          Journal:  Phys Rev Lett        ISSN: 0031-9007            Impact factor:   9.161


  4 in total

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Authors:  Zoe Budrikis; Alessandro L Sellerio; Zsolt Bertalan; Stefano Zapperi
Journal:  Sci Rep       Date:  2015-03-11       Impact factor: 4.379

2.  The interplay of crack hopping, delamination and interface failure in drying nanoparticle films.

Authors:  Bin Yang; James S Sharp; Mike I Smith
Journal:  Sci Rep       Date:  2016-08-25       Impact factor: 4.379

3.  The shape of telephone cord blisters.

Authors:  Yong Ni; Senjiang Yu; Hongyuan Jiang; Linghui He
Journal:  Nat Commun       Date:  2017-01-20       Impact factor: 14.919

4.  Post-buckling behaviors of thin-film soft-substrate bilayers with finite-thickness substrate.

Authors:  Meng Li; Bohua Sun
Journal:  Sci Rep       Date:  2022-03-08       Impact factor: 4.379

  4 in total

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