Literature DB >> 22488746

Carbon-carbon contacts for robust nanoelectromechanical switches.

Owen Loh1, Xiaoding Wei, John Sullivan, Leonidas E Ocola, Ralu Divan, Horacio D Espinosa.   

Abstract

Nanoelectromechanical devices exhibiting dramatically improved robustness through novel material selection are demonstrated. A unique combination of carbon nanotube active elements and conductive diamond-like carbon contact electrodes results in reliable switching performance not found in devices with ubiquitously-used metal thin film electrodes. This in turn represents a viable means to improve the reliability of a diverse, and widely-pursued class of nanoscale devices ranging from single-nanostructure switches to massively parallel arrays.
Copyright © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

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Year:  2012        PMID: 22488746     DOI: 10.1002/adma.201104889

Source DB:  PubMed          Journal:  Adv Mater        ISSN: 0935-9648            Impact factor:   30.849


  5 in total

1.  Nanoelectromechanical contact switches.

Authors:  Owen Y Loh; Horacio D Espinosa
Journal:  Nat Nanotechnol       Date:  2012-04-29       Impact factor: 39.213

Review 2.  Review: Electrostatically actuated nanobeam-based nanoelectromechanical switches - materials solutions and operational conditions.

Authors:  Liga Jasulaneca; Jelena Kosmaca; Raimonds Meija; Jana Andzane; Donats Erts
Journal:  Beilstein J Nanotechnol       Date:  2018-01-25       Impact factor: 3.649

3.  3D Finite Element Simulation of Graphene Nano-Electro-Mechanical Switches.

Authors:  Jothiramalingam Kulothungan; Manoharan Muruganathan; Hiroshi Mizuta
Journal:  Micromachines (Basel)       Date:  2016-08-15       Impact factor: 2.891

Review 4.  Electrostatic pull-in application in flexible devices: A review.

Authors:  Teng Cai; Yuming Fang; Yingli Fang; Ruozhou Li; Ying Yu; Mingyang Huang
Journal:  Beilstein J Nanotechnol       Date:  2022-04-12       Impact factor: 3.272

5.  Vertical, capacitive microelectromechanical switches produced via direct writing of copper wires.

Authors:  Zhiran Yi; Jianjun Guo; Yining Chen; Haiqing Zhang; Shuai Zhang; Gaojie Xu; Minfeng Yu; Ping Cui
Journal:  Microsyst Nanoeng       Date:  2016-04-25       Impact factor: 7.127

  5 in total

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