Literature DB >> 22418563

Light extraction efficiency improvement by multiple laser stealth dicing in InGaN-based blue light-emitting diodes.

Yiyun Zhang1, Haizhong Xie, Haiyang Zheng, Tongbo Wei, Hua Yang, Jing Li, Xiaoyan Yi, Xiangyang Song, Guohong Wang, Jinmin Li.   

Abstract

We report a multiple laser stealth dicing (multi-LSD) method to improve the light extraction efficiency (LEE) of InGaN-based light-emitting diodes (LEDs) using a picosecond (Ps) laser. Compared with conventional LEDs scribed by a nanosecond (Ns) laser and single stealth-diced LEDs, the light output power (LOP) of the LEDs using multi-LSD method can be improved by 26.5% and 11.2%, respectively. The enhanced LOP is due to the increased side emission from the large-area roughened sidewalls of the sapphire substrates fabricated in the multi-LSD process. Numerical simulation results show that the multi-LSD process has little thermal damages to the multiple quantum wells (MQWs) of the LEDs.

Mesh:

Year:  2012        PMID: 22418563     DOI: 10.1364/OE.20.006808

Source DB:  PubMed          Journal:  Opt Express        ISSN: 1094-4087            Impact factor:   3.894


  4 in total

1.  High Luminous Efficacy Phosphor-Converted Mass-Produced White LEDs Achieved by AlN Prebuffer and Transitional-Refraction-Index Patterned Sapphire Substrate.

Authors:  Shuo Zhang; Meng Liang; Yan Yan; Jinpeng Huang; Yan Li; Tao Feng; Xueliang Zhu; Zhicong Li; Chenke Xu; Junxi Wang; Jinmin Li; Zhiqiang Liu; Xiaoyan Yi
Journal:  Nanomaterials (Basel)       Date:  2022-05-11       Impact factor: 5.719

2.  Spatial zigzag evolution of cracks in moving sapphire initiated by bursts of picosecond laser pulses for ultrafast wafer dicing.

Authors:  Mindaugas Gedvilas; Gediminas Račiukaitis
Journal:  RSC Adv       Date:  2020-09-08       Impact factor: 4.036

3.  Multi-Foci Laser Separation of Sapphire Wafers with Partial Thickness Scanning.

Authors:  Celescia Siew Mun Lye; Zhongke Wang; Yee Cheong Lam
Journal:  Micromachines (Basel)       Date:  2022-03-24       Impact factor: 2.891

4.  Precision Layered Stealth Dicing of SiC Wafers by Ultrafast Lasers.

Authors:  Bo Yang; Heng Wang; Sheng Peng; Qiang Cao
Journal:  Micromachines (Basel)       Date:  2022-06-27       Impact factor: 3.523

  4 in total

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