| Literature DB >> 22303147 |
Hassan Hajghassem1, Seyedeh Maryam Banihashemian, Majidreza Aliahmadi.
Abstract
A Si/SiO(2)/CuPt structure is formed by depositing a very thin SiO(2) layer between CuPt and P-type Si layers using e-beam evaporation. SEM images show the formation of CuPt nano clusters with an average size of less than 100 nm. This structure shows high sensitivity to applied magnetic fields at 77K and at low and high dc voltages such that magnetic field as low as 6 mT is detected using I-V and I-B measurements. The variation of current with various magnetic field strength at the constant voltage shows also an oscillatory behavior. The sensitivity of this structure to magnetic fields is believed to be due to small nano size of the platinum-copper structures as well as their discrete energy states and the tunneling of carriers into the insulating layer. Our results indicate that this structure may be a good candidate for small, simple, low cost and sensitive low magnetic field detectors.Entities:
Keywords: Cu-Pt nano clusters; I-V Curve; magnetic field detection
Year: 2009 PMID: 22303147 PMCID: PMC3267195 DOI: 10.3390/s91209734
Source DB: PubMed Journal: Sensors (Basel) ISSN: 1424-8220 Impact factor: 3.576
Figure 1.Cu-Pt film (8 nm) on a p type silicon with an ultra thin insulating (SiO2) layer and CuPt (8nm)/SiO2 (5 nm)/Si (50,000 nm)/SiO2 (5 nm)/CuPt (8 nm) array structure Fabrication procedure is shown on the left and the measurement procedure is shown on the right.
Figure 2.(a) SEM image of CuPt nano cluster on SiO2/Si surface. (b) Distribution of cluster diameter in an area of 5 μm by 6 μm.
Figure 3.I-V Curve made at liquid nitrogen temperature and room temperature (inset of Figure3) for CuPt/Sio2/Si/Sio2/CuPt structure respectively. External magnetic field is applied parallel to the surface of the device for low voltages.
Figure 4.I-V Curve made at liquid nitrogen temperature and room temperature (inset of Figure 4) for CuPt/Sio2/Si/Sio2/CuPt structure respectively. External magnetic field is applied parallel to the surface of the device for higher voltages.
Figure 5.Current as a function of external field applied to the junction at 77 K for different voltages.