Literature DB >> 22255921

Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system.

Tom Sterken1, Jan Vanfleteren, Tom Torfs, Maaike Op de Beeck, Frederick Bossuyt, Chris Van Hoof.   

Abstract

A comfortable, wearable wireless ECG monitoring system is proposed. The device is realized using the combination of two proprietary advanced technologies for electronic packaging and interconnection : the UTCP (Ultra-Thin Chip Package) technology and the SMI (Stretchable Mould Interconnect) technology for elastic and stretchable circuits. Introduction of these technologies results in small fully functional devices, exhibiting a significant increase in user comfort compared to devices fabricated with more conventional packaging and interconnection technologies.

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Year:  2011        PMID: 22255921     DOI: 10.1109/IEMBS.2011.6091734

Source DB:  PubMed          Journal:  Conf Proc IEEE Eng Med Biol Soc        ISSN: 1557-170X


  1 in total

1.  Relationship between Contact Pressure and Motion Artifacts in ECG Measurement with Electrostatic Flocked Electrodes Fabricated on Textile.

Authors:  Toshihiro Takeshita; Manabu Yoshida; Yusuke Takei; Atsushi Ouchi; Akinari Hinoki; Hiroo Uchida; Takeshi Kobayashi
Journal:  Sci Rep       Date:  2019-04-11       Impact factor: 4.379

  1 in total

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