Literature DB >> 22200050

A controllable transformation in copper valence states and its applications.

Jing Yang1, Le Xin Song, Jun Yang, Zheng Dang, Jie Chen.   

Abstract

The present study revealed a surprising valence transformation of copper (Cu) in the sintering process of mixtures of copper chloride dihydrate (CuCl(2)·2H(2)O) with β-cyclodextrin (β-CD) in ambient atmosphere. Such a transformation in Cu valence states can be modulated by changing the initial molar ratio (IMR) of CuCl(2)·2H(2)O to β-CD in the mixtures. Firstly, as the value of IMR decreased, the content of cuprous chloride (CuCl) decreased, while the content of cupric oxide (CuO) increased gradually. That is to say, there is an unambiguous IMR-dependence of the contents of CuCl and CuO formed. However, such a controllable valence transformation from Cu(II) to Cu(I) to Cu(II) did not happen in nitrogen atmosphere. Secondly, the in situ composite of CuCl and CuO produced a highly ordered structure of self-assembled nanowires, intertwined, with a diameter of 30 to 50 nm. Furthermore, electronic structural analysis provided direct evidence that the Cu-Cl and Cu-O bonds in this composite material were simultaneously impaired by self-assembled growth. Finally, we noticed that the photoluminescence property of CuCl was regulated through the formation of composites with CuO. In addition, this in situ composite synthesis technique was used to modify the magnetic property of CuO. Furthermore, the anomalous ferromagnetic behaviour of the CuO nanocrystal was observed and explained. In short, this work not only demonstrates a flexible and easily controllable valence transformation of Cu, but also provides a novel approach for constructing inorganic nanocomposite materials. We believe that the implications of these findings are important and make significant contributions to the development of inorganic chemistry and material science.

Entities:  

Year:  2011        PMID: 22200050     DOI: 10.1039/c2dt11666a

Source DB:  PubMed          Journal:  Dalton Trans        ISSN: 1477-9226            Impact factor:   4.390


  1 in total

1.  Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design.

Authors:  Woochang Kim; Chihyun Kim; Wonseok Lee; Jinsung Park; Duckjong Kim
Journal:  Biomolecules       Date:  2021-01-20
  1 in total

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