Literature DB >> 22180159

Imbricate scales as a design construct for microsystem technologies.

Seok Kim1, Yewang Su, Agustin Mihi, Seungwoo Lee, Zhuangjian Liu, Tanmay K Bhandakkar, Jian Wu, Joseph B Geddes, Harley T Johnson, Yongwei Zhang, Jung-Ki Park, Paul V Braun, Yonggang Huang, John A Rogers.   

Abstract

Spatially overlapping plates in tiled configurations represent designs that are observed widely in nature (e.g., fish and snake scales) and man-made systems (e.g., shingled roofs) alike. This imbricate architecture offers fault-tolerant, multifunctional capabilities, in layouts that can provide mechanical flexibility even with full, 100% areal coverages of rigid plates. Here, the realization of such designs in microsystems technologies is presented, using a manufacturing approach that exploits strategies for deterministic materials assembly based on advanced forms of transfer printing. The architectures include heterogeneous combinations of silicon, photonic, and plasmonic scales, in imbricate layouts, anchored at their centers or edges to underlying substrates, ranging from elastomer sheets to silicon wafers. Analytical and computational mechanics modeling reveal distributions of stress and strain induced by deformation, and provide some useful design rules and scaling laws.
Copyright © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Entities:  

Year:  2011        PMID: 22180159     DOI: 10.1002/smll.201101832

Source DB:  PubMed          Journal:  Small        ISSN: 1613-6810            Impact factor:   13.281


  3 in total

1.  Flexible electronic/optoelectronic microsystems with scalable designs for chronic biointegration.

Authors:  Enming Song; Chia-Han Chiang; Rui Li; Xin Jin; Jianing Zhao; Mackenna Hill; Yu Xia; Lizhu Li; Yuming Huang; Sang Min Won; Ki Jun Yu; Xing Sheng; Hui Fang; Muhammad Ashraful Alam; Yonggang Huang; Jonathan Viventi; Jan-Kai Chang; John A Rogers
Journal:  Proc Natl Acad Sci U S A       Date:  2019-07-15       Impact factor: 11.205

2.  Peel-and-stick: mechanism study for efficient fabrication of flexible/transparent thin-film electronics.

Authors:  Chi Hwan Lee; Jae-Han Kim; Chenyu Zou; In Sun Cho; Jeffery M Weisse; William Nemeth; Qi Wang; Adri C T van Duin; Taek-Soo Kim; Xiaolin Zheng
Journal:  Sci Rep       Date:  2013-10-10       Impact factor: 4.379

3.  Heterogeneously Assembled Metamaterials and Metadevices via 3D Modular Transfer Printing.

Authors:  Seungwoo Lee; Byungsoo Kang; Hohyun Keum; Numair Ahmed; John A Rogers; Placid M Ferreira; Seok Kim; Bumki Min
Journal:  Sci Rep       Date:  2016-06-10       Impact factor: 4.379

  3 in total

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