Literature DB >> 22012927

Isolation of polymorphic microsatellite markers and tests of cross-amplification in four widespread European calcicole ferns.

G Arjen de Groot1, Helena Korpelainen, E R Jasper Wubs, Roy Erkens.   

Abstract

PREMISE OF THE STUDY: Studies on the biogeography and population genetics of the widespread European rock ferns Asplenium scolopendrium, A. trichomanessubsp. quadrivalens, Polystichum setiferum, and P. aculeatumwould potentially yield interesting new insights into the colonization capacities of ferns. Markers with sufficient resolution for detailed genetic studies are, however, not yet available. METHODS AND
RESULTS: Using genome screening with intersimple sequence repeat (ISSR) primers, a total of 16 different microsatellite markers were isolated and characterized for the four species. Some of these markers could be exchanged within each congeneric pair.
CONCLUSIONS: The developed primer sets will be very useful for analyses of the biogeography and population genetics of some widespread calcicole ferns. The observed cross-amplification rates suggest a high potential for application on additional species from the same genera.

Entities:  

Mesh:

Substances:

Year:  2011        PMID: 22012927     DOI: 10.3732/ajb.1100051

Source DB:  PubMed          Journal:  Am J Bot        ISSN: 0002-9122            Impact factor:   3.844


  2 in total

1.  Diverse spore rains and limited local exchange shape fern genetic diversity in a recently created habitat colonized by long-distance dispersal.

Authors:  G A De Groot; H J During; S W Ansell; H Schneider; P Bremer; E R J Wubs; J W Maas; H Korpelainen; R H J Erkens
Journal:  Ann Bot       Date:  2012-02-09       Impact factor: 4.357

2.  Inter-and intraspecific variation in fern mating systems after long-distance colonization: the importance of selfing.

Authors:  G Arjen de Groot; Betty Verduyn; E R Jasper Wubs; Roy H J Erkens; Heinjo J During
Journal:  BMC Plant Biol       Date:  2012-01-04       Impact factor: 4.215

  2 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.