Whole Field Strain Measurement on Complex Surfaces by Digital Speckle Pattern Interferometry.

Digital Speckle Pattern Interferometry (DSPI), originally known as electronic speckle pattern interferometry (ESPI), is an interferometry based method applicable for conducting 3-dimensional whole field strain characterization. The present DSPI systems are suited for analyzing a relatively simple surface (e.g., a plane surface). However, few existing systems are able to accurately determine strain distributions on a surface with significant contour complexity. Here, we present development of a novel DSPI system that allows strain characterization of a sample with a complex surface. In the described DSPI system, deformations and contours as well as an absolute phase value are determined. Furthermore, variations in measurement sensitivity are considered. We describe a principle and methodology using two examples in the area of mechanical engineering and biomedical engineering, and discuss potential usages and future directions.