Fabrication of mesoporous silica/polymer composites through solvent evaporation process and investigation of their excellent low thermal expansion property.

We fabricate mesoporous silica/epoxy polymer composites through a solvent evaporation process. The easy penetration of the epoxy polymers into mesopores is achieved by using a diluted polymer solution including a volatile organic solvent. After the complete solvent evaporation, around 90% of the mesopores are estimated to be filled with the epoxy polymer chains. Here we carefully investigate the thermal expansion behavior of the obtained mesoporous silica/polymer composites. Thermal mechanical analysis (TMA) charts revealed that coefficient of linear thermal expansion (CTE) gradually decreases, as the amount of the doped mesoporous silica increases. Compared with spherical silica particle without mesopores, mesoporous silica particles show a greater effect on lowering the CTE values. Interestingly, it is found that the CTE values are proportionally decreased with the decrease of the total amount of the polymers outside the mesopores. These data demonstrate that polymers embedded inside the mesopores become thermally stable, and do not greatly contribute to the thermal expansion behavior of the composites.