| Literature DB >> 21178224 |
Chung-Hoon Lee1, Clark S Ritz, Minghuang Huang, Michael W Ziwisky, Robert J Blise, Max G Lagally.
Abstract
Integrated freestanding single-crystal silicon nanowires with typical dimension of 100 nm × 100 nm × 5 µm are fabricated by conventional 1:1 optical lithography and wet chemical silicon etching. The fabrication procedure can lead to wafer-scale integration of silicon nanowires in arrays. The measured electrical transport characteristics of the silicon nanowires covered with/without SiO(2) support a model of Fermi level pinning near the conduction band. The I-V curves of the nanowires reveal a current carrier polarity reversal depending on Si-SiO(2) and Si-H bonds on the nanowire surfaces.Entities:
Year: 2010 PMID: 21178224 DOI: 10.1088/0957-4484/22/5/055704
Source DB: PubMed Journal: Nanotechnology ISSN: 0957-4484 Impact factor: 3.874