| Literature DB >> 20730080 |
An-Ya Lo, Shang-Bin Liu, Cheng-Tzu Kuo.
Abstract
To improve the understanding on CNT growth modes, the various processes, including thermal CVD, MP-CVD and ECR-CVD, have been used to deposit CNTs on nanoporous SBA-15 and Si wafer substrates with C(2)H(2) and H(2) as reaction gases. The experiments to vary process parameter of DeltaT, defined as the vector quantities of temperature at catalyst top minus it at catalyst bottom, were carried out to demonstrate its effect on the CNT growth mode. The TEM and TGA analyses were used to characterize their growth modes and carbon yields of the processes. The results show that DeltaT can be used to monitor the temperature gradient direction across the catalyst nanoparticle during the growth stage of CNTs. The results also indicate that the tip-growth CNTs, base-growth CNTs and onion-like carbon are generally fabricated under conditions of DeltaT > 0, <0 and ~0, respectively. Our proposed growth mechanisms can be successfully adopted to explain why the base- and tip-growth CNTs are common in thermal CVD and plasma-enhanced CVD processes, respectively. Furthermore, our experiments have also successfully demonstrated the possibility to vary DeltaT to obtain the desired growth mode of CNTs by thermal or plasma-enhanced CVD systems for different applications.Entities:
Year: 2010 PMID: 20730080 PMCID: PMC2920429 DOI: 10.1007/s11671-010-9648-4
Source DB: PubMed Journal: Nanoscale Res Lett ISSN: 1556-276X Impact factor: 4.703
Figure 1Schematic diagram of a thermal CVD system with a pre-heating zone
Specimen designations and their deposition conditions by thermal CVD
| Spec. desig. a | tb (min) | Catalyst/substrate | Sub. surface condition c | Temp. d | Δ | CNTs growth mode |
|---|---|---|---|---|---|---|
| A1–5 | 5 | Co/SBA-15 | R | 25/800 | – | Base-growth |
| A1–10 | 10 | |||||
| A1–15 | 15 | |||||
| A1–20 | 20 | |||||
| A1–30 | 30 | |||||
| A1–40 | 40 | |||||
| A1–65 | 65 | |||||
| A1–90 | 90 | |||||
| A2–20 | 20 | Co/Si (001) | S | 25/800 | – | Base-growth |
| A3–20 | 20 | Co/SBA-15 | R | 800/600 | + | Tip-growth |
| A4–20 | 20 | Co/Si (001) | S | 800/600 | + | Tip-growth |
| A5–20 | 20 | Co/SBA-15 | R | 650/650 | ~0 | No CNTs |
| A6–5 | 5 | Co/SBA-15 | R | 800/800 | ~0 | No CNTs |
| A6–10 | 10 | |||||
| A6–15 | 15 | |||||
| A7–5 | 5 | No cata./SBA-15 | R | 25/800 | – | No CNTs |
| A7–10 | 10 | |||||
| A7–15 | 15 | |||||
| A8–5 | 5 | No cata./SBA-15 | R | 800/800 | ~0 | No CNTs |
| A8–15 | 15 | |||||
| A8–25 | 25 |
a Other deposition conditions: H2/C2H2 = 50/50 (sccm/sccm); 3 kPa pressure
b t: CNTs deposition time
c Conditions of the substrate surface, R Rough (porous) and S Smooth surface
dT: the pre-heated temperature of the reaction gas; T: the substrate temperature at heating zone
e∆T = temperature of catalyst at the top minus at the bottom. Its sign represents the temperature gradient direction
Specimen designations and their deposition conditions by plasma-enhanced CVD
| Spec. desig. | Method a | Bias b Vpre | Dep. Time c (min) | ∆ | Growth Mode | ||
|---|---|---|---|---|---|---|---|
| B1 | MP | 800/800 | 100/120 | 467/500 | 5 | + | Tip-growth |
| B2 | 1,000/600 | 100/60 | 520/507 | 2 | − | Base-growth | |
| C1 | ECR | 250/270 | 100/120 | 500/530 | 5 | + | Tip-growth |
| C2 | 300/240 | 120/100 | 750/631 | 4 | − | Base-growth |
aMP Microwave plasma CVD, ECR Electron cyclotron resonance CVD, The working pressures in MP and ECR are 1.3 kPa and 0.9 Pa, respectively
bWpre, and Vpre = microwave power, and bias voltage during the H-plasma pre-treatment step (H2 = 50 sccm), respectively
Wdep, Vdep, TSi, and TSf = microwave power, bias voltage, initial and final substrate temperature of the deposition step (H2/C2H2 flow ratio = 50/10 (sccm/sccm); pressure = 10 Torr), respectively
c CNTs deposition time in minute
d∆T = temperature of catalyst at the top minus at the bottom. Its sign represents the temperature gradient direction
Figure 2Schematic diagrams to show the temperature distribution across a catalyst particle for different deposition systems: a thermal CVD and b plasma-enhanced CVD systems
Figure 3TEM images of the as-deposited CNTs on SBA-15 substrate by thermal CVD without gas pre-heating: abright field and b corresponding dark field images (Specimen A1–20)
Figure 4TEM image of the as-deposited CNTs on Si wafer substrate by thermal CVD without gas pre-heating a low magnification and b higher magnification images (Specimen A2–20)
Figure 5TEM images of the as-deposited CNTs on SBA-15 substrate by thermal CVD with gas pre-heating (gas temperature > substrate temperature): a well-structured CNTs and b CNTs with blurred microstructure (Specimen A3–20)
Figure 6TEM images of the as-deposited CNTs on Si wafer substrate by thermal CVD with gas pre-heating (gas temperature > substrate temperature): a low magnification and b higher magnification images (Specimen A4–20)
Figure 7TEM images of the as-deposited carbon structure on SBA-15 substrate by thermal CVD with gas pre-heating (gas temperature = substrate temperature): a low magnification and b higher magnification images (Specimen A6–5)
Figure 8TGA curve of the as-deposited CNTs on SBA-15 substrate by thermal CVD without gas pre-heating (Specimen A1–20)
Figure 9Carbon yield (wt%) versus deposition time curves of the as-deposited CNTs deposited by thermal CVD for specimens with different deposition conditions: a A1, b A6, c A7 and d A8-series, respectively
Figure 10Schematic drawn to show substrate temperature variations of two different process sequences in growth stage, a temperature-rising and b temperature-declining
Figure 11TEM images of the as-deposited CNTs on Si wafer substrate by MP-CVD with schemes of a temperature-rising and b temperature-declining sequences in Fig. 10, respectively (Specimens B1 and B2)
Figure 12TEM images of the as-deposited CNTs on Si wafer substrate by ECR-CVD with schemes of a temperature-rising and b temperature-declining sequences in Fig. 10, respectively (Specimens C1 and C2)
Figure 13Our proposed CNTs growth mechanisms: a base-growth model and b tip-growth model