Literature DB >> 19961181

Low dielectric constant materials.

Willi Volksen1, Robert D Miller, Geraud Dubois.   

Abstract

Year:  2010        PMID: 19961181     DOI: 10.1021/cr9002819

Source DB:  PubMed          Journal:  Chem Rev        ISSN: 0009-2665            Impact factor:   60.622


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  24 in total

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4.  Enhanced Thermo-Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores.

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5.  Reprocessable and recyclable styrene-based resins with low dielectric and good mechanical properties.

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9.  Porous polyimide membranes prepared by wet phase inversion for use in low dielectric applications.

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10.  Broadband Dielectric Spectroscopic Characterization of Thermal Stability of Low-k Dielectric Thin Films for Micro- and Nanoelectronic Applications.

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