Literature DB >> 19948342

Copper oxide-decorated porous carbons for carbon dioxide adsorption behaviors.

Byung-Joo Kim1, Ki-Sook Cho, Soo-Jin Park.   

Abstract

Copper oxide-loaded porous carbons (PCs) for high efficient carbon dioxide capture were prepared. Copper oxides were loaded onto porous carbons by a postoxidation method involving copper electroplated PCs at 300 degrees C in an air stream. Additionally, porous carbons were prepared from ion-exchangeable polymeric resin by a chemical activation method. The microstructure of the copper oxide/PCs was characterized by XRD, and the formation of copper oxides after the postoxidation process was confirmed by XPS. The carbon dioxide adsorption behaviors were evaluated by a PCT (pressure-composition-temperature) apparatus at 298K and 1.0atm. It was found that the presence of copper oxides significantly led to an increase in the carbon dioxide adsorption capacity of the carbons. Copper oxide nanoparticles have electron-donor features, resulting in the enhancement of adsorption capacity of carbon dioxide molecules, which have an electron acceptor feature. Copyright 2009. Published by Elsevier Inc.

Entities:  

Year:  2009        PMID: 19948342     DOI: 10.1016/j.jcis.2009.10.045

Source DB:  PubMed          Journal:  J Colloid Interface Sci        ISSN: 0021-9797            Impact factor:   8.128


  2 in total

1.  Oxygen-enriched surface modification for improving the dispersion of iron oxide on a porous carbon surface and its application as carbon molecular sieves (CMS) for CO2/CH4 separation.

Authors:  Nur Indah Fajar Mukti; Teguh Ariyanto; Wahyudi Budi Sediawan; Imam Prasetyo
Journal:  RSC Adv       Date:  2021-11-16       Impact factor: 4.036

2.  Reactivity of heteropolytungstate and heteropolymolybdate metal transition salts in the synthesis of dimethyl carbonate from methanol and CO₂.

Authors:  Ahmed Aouissi; Salem S Al-Deyab; Ahmad Al-Owais; Amro Al-Amro
Journal:  Int J Mol Sci       Date:  2010-07-23       Impact factor: 5.923

  2 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.