Literature DB >> 19946927

First-principles simulations of conditions of enhanced adhesion between copper and TaN(111) surfaces using a variety of metallic glue materials.

Bo Han1, Jinping Wu, Chenggang Zhou, Bei Chen, Roy Gordon, Xinjian Lei, David A Roberts, Hansong Cheng.   

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Year:  2010        PMID： 19946927     DOI： 10.1002/anie.200905360

Source DB:  PubMed          Journal:  Angew Chem Int Ed Engl        ISSN： 1433-7851            Impact factor:   15.336


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  1 in total

1.  Control of the Cu morphology on Ru-passivated and Ru-doped TaN surfaces - promoting growth of 2D conducting copper for CMOS interconnects.

Authors:  Cara-Lena Nies; Suresh Kondati Natarajan; Michael Nolan
Journal:  Chem Sci       Date:  2021-12-13       Impact factor: 9.825
  1 in total

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